Microelectronics Packaging Market Size 2024: Global Share, Industry And Report Analysis By 2031 | Silicon Connection Pte Ltd. Siliconware Precision Industries Co., Ltd. STI Electronics, Inc.

Microelectronics packaging market is anticipated to grow at a CAGR of 7.6% during the forecast period (2024-2031). Microelectronics packaging involves encasing and protecting microelectronic components such as Integrated Circuits (ICs) and semiconductors from external damage to ensure their smooth functionality and durability in various applications. It encompasses a range of packaging technologies, including Chip-On-Board (COB), Ball Grid Array (BGA), and flip-chip, which are essential for devices such as smartphones, computers, and automotive electronics. Further, the market is expected to experience significant growth in the future attributed to the growing miniaturization of electronic components, expanding application of microelectronics packaging in the automotive industry, increasing demand for packaging solutions in the consumer electronics industry, and rising adoption of the Internet of Things (IoT) and wearable technology.

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The demand for microelectronic packaging is being driven by the trend towards developing smaller and lighter electronic devices without sacrificing performance or functionality. Microelectronics packaging plays a crucial role in integrating multiple functionalities into smaller form factors, improving thermal management, and increasing component density. These abilities of the technology to address miniaturization complexities foster technological progress and contribute to growth in the packaging sector to meet the changing needs of consumer electronics, automotive systems, and industrial applications, driving market growth. For instance, in May 2021, IBM introduced the world's first 2 nanometer (nm) chip using nanosheet technology, representing a significant advancement in semiconductor design. This technology is expected to offer 45.0% higher performance, or 75.0% lower energy consumption compared to 7 nm node chips, meeting the rising demand for enhanced performance and energy efficiency in various applications.

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• Market Coverage
• Market number available for - 2024-2031
• Base year- 2024
• Forecast period- 2024-2031
• Segment Covered- By Source, By Product Type, By Applications
• Competitive Landscape- Archer Daniels Midland Co., Ingredion Inc., Kerry Group Plc, Cargill
• Inc., and others

Market Segmentation
Global Microelectronics Packaging Market by Packaging Type
o Ball Grid Array (BGA)
o Chip-on-Board (COB)
o Surface Mount Technology (SMT)
o Through-Hole Technology (THT
o Package-on-Package (PoP)
o Flip-Chip
o System-in-Package (SiP)

Global Microelectronics Packaging Market by Technology
o Wafer-Level Packaging (WLP)
o Tape Carrier Package (TCP)
o Die-Level Packaging
o Others ((3D Packaging, Fan-Out Wafer-Level Packaging (Fowlp), And System-In-Package (SiP))

Global Microelectronics Packaging Market by Material Type
o Organic Substrates
o Ceramic Substrates
o Silicon Substrates
o Metal Substrates

Global Microelectronics Packaging Market by Application
o Consumer Electronics
o Automotive
o Healthcare
o Industrial
o Telecommunications
o Aerospace & Defense
o Energy

Regional Analysis
o North America
o United States
o Canada
o Europe
o UK
o Germany
o Italy
o Spain
o France
o Rest of Europe
o Asia-Pacific
o China
o India
o Japan
o South Korea
o Rest of Asia-Pacific
o Rest of the World
o Latin America
o Middle East and Africa

Company Profiles
o Amkor Technology
o ChipMOS Technologies Inc.
o Deca Technologies Inc.
o Fujitsu Ltd.
o iangsu Changdian Technology Co., Ltd.
o KLA Corp.
o Micron Technology, Inc.
o NXP Semiconductors
o SCHOTT
o Shinko Electric Industries Co., Ltd.
o Silicon Connection Pte Ltd.
o Siliconware Precision Industries Co., Ltd.
o STI Electronics, Inc.
o Taiwan Semiconductor Manufacturing Co. Ltd.
o Texas Instruments Inc.
o Tongfu Microelectronics Co., Ltd.
o Xilinx, Inc. (AMD)

The Report Covers
• Market value data analysis of 2023 and forecast to 2031.
• Annualized market revenues ($ million) for each market segment.
• Country-wise analysis of major geographical regions.
• Key companies operating in the global microelectronics packaging market. Based on the availability of data, information related to new product launches, and relevant news is also available in the report.
• Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
• Analysis of market-entry and market expansion strategies.
• Competitive strategies by identifying 'who-stands-where' in the market.

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