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Fan-Out Wafer Level Packaging Market Growth Analysis, Share And Report By 2033
Fan-Out Wafer Level Packaging Market Growth
According to The Business Research Company's, the endoscopy video systems market size has grown strongly in recent years. It will grow from $24.58 billion in 2023 to $26.56 billion in 2024 at a compound annual growth rate (CAGR) of 8.1%. The growth in the historic period can be attributed to minimally invasive surgery (mis), training and education, patient and surgeon safety, digital transformation in healthcare.
The endoscopy video systems market size is expected to see strong growth in the next few years. It will grow to $35.08 billion in 2028 at a compound annual growth rate (CAGR) of 7.2%. The growth in the forecast period can be attributed to global expansion of healthcare, patient-centered care, endoscopy in specialized fields, wireless and portable systems. Major trends in the forecast period include technological advancements, artificial intelligence integration, 3d imaging, augmented reality (ar) visualization.
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Market Drivers and Trends:5G technology adoption in emerging countries is expected to propel the growth of the fan-out wafer-level packaging market in the coming future. 5G is the fifth generation of cellular network technology designed to increase speed, reduce latency and improve the flexibility of wireless services. Fan-out wafer-level packaging helps 5G technology by providing shorter interconnects and reduced inductance, enhancing RF and millimeter-wave performance. For instance, in April 2023, according to 5G Americas, a US-based trade association representing major telecom companies, between the end of 2021 and the end of 2022, global 5G wireless internet connections ascended by 76%, reaching 1.05 billion. Further, North America leads the way in wireless 5G connection adoption, reaching 507 million Volte and 119 million 5G connections expected by the end of the fourth quarter of 2022. Therefore, 5G technology adoption in emerging countries is driving the fan-out wafer-level packaging market.
Major companies operating in the fan-out wafer-level packaging market are focusing on advanced next-generation graphics DRAM technology to provide reliable services to customers. Next-generation graphics DRAM technology refers to evolving and improving memory components specifically designed for graphics processing units (GPUs) and other graphics-intensive applications. For instance, in November 2022, Samsung Electronics Co. Ltd., a South Korea-based consumer electronics company, launched GDDR6W, the industry's first next-generation graphics DRAM technology with doubled capacity and performance based on cutting-edge fan-out wafer-level packaging (FOWLP) technology. This significantly increases memory bandwidth and capacity with immense performance, massive storage and extensive bandwidth memory technologies that are assisting in bringing the virtual realm closer to reality.
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Major Key Players of the Market: Samsung Electronics Co. Ltd., Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, Qualcomm Inc., Fujitsu Limited, Toshiba Corporation, Applied Materials Inc., ASE Technology Holding Co. Ltd., Texas Instruments Incorporated, Lam Research Corporation, STMicroelectronics N.V., Infineon Technologies AG, NXP Semiconductors N.V., Analog Devices Inc., Renesas Electronics Corporation, United Microelectronics Corporation, GlobalFoundries Inc., Amkor Technology Inc., Microchip Technology Inc., Synopsys Inc., Xilinx Inc., Siliconware Precision Industries Co Ltd., Onto Innovation Inc., Unisem Group, Nepes Corporation, Deca Technologies Inc., Yield Engineering Systems Inc., Powertech Technology Inc., Jiangsu Changdian Technology Co. Ltd., Yole Group.
Fan-Out Wafer Level Packaging Market 2024 Key Insights:
• The fan-out wafer level packaging is expected to grow to $3.94 billion in 2028 at a compound annual growth rate (CAGR) of 12.8%.
• 5G Technology Expansion Fuels Growth In The Fan-Out Wafer-Level Packaging Market
• Growing Influence Of Iot Devices On The Fan-Out Wafer-Level Packaging Market
• Asia-Pacific was the largest region in the fan-out wafer level packaging market in 2023
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