Molded Interconnect Substrate (MIS) Market Revenue, Insights, Overview, Outlook, Analysis | Valuates Reports

Molded Interconnect Substrate (MIS) Market Size

The global Molded Interconnect Substrate (MIS) market was valued at US$ 536 million in 2023 and is anticipated to reach US$ 1244 million by 2030, witnessing a CAGR of 12.8% during the forecast period 2024-2030.

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North American market for Molded Interconnect Substrate (MIS) is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.

Asia-Pacific market for Molded Interconnect Substrate (MIS) is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.

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The major global manufacturers of Molded Interconnect Substrate (MIS) include ASM Advanced Packaging Materials, Unisem, Advanpack, ASE Material, Carsem, JCET Group, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.

By Type
• Single Layer
• Multilayer

By Application
• Analog Chip
• Power IC
• Digital Currency

Key Companies
ASM Advanced Packaging Materials, Unisem, Advanpack, ASE Material, Carsem, JCET Group

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