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Radiation Hardened Electronics Market Size Report, 2033

Radiation Hardened Electronics Market Size

Radiation Hardened Electronics Market Size

The new report published by The Business Research Company, titled ""Radiation-Hardened Electronics Global Market Report 2024 - Market Size, Trends, And Global Forecast 2024-2033"", delivers an in-depth analysis of the leading size and forecasts, investment opportunities, winning strategies, market drivers and trends, competitive landscape, and evolving market trends.

As per the report, the radiation-hardened electronics market size has grown steadily in recent years. It will grow from $1.68 billion in 2023 to $1.76 billion in 2024 at a compound annual growth rate (CAGR) of 4.3%. The radiation-hardened electronics market size is expected to see steady growth in the next few years. It will grow to $2.09 billion in 2028 at a compound annual growth rate (CAGR) of 4.4%.

Download Free Sample Report @ https://www.thebusinessresearchcompany.com/sample.aspx?id=8634&type=smp

Rising Number Of Satellites To Drive Market Growth
The increasing number of satellites is expected to propel the growth of the radiation-hardened electronics market going forward. A satellite is a tool that is launched into space to orbit the Earth and collect data. Rad-hard electronics can withstand extreme radiation and temperatures better than commercial-grade chips, which makes them suitable for space environments and are preferred to be used in satellites by space agencies, private spaceflight companies, and others. For instance, according to United Nations Office for Outer Space Affairs (UNOOSA) records, 8,261 satellites are orbiting the Earth now, of which only 4,852 satellites are active. Therefore, the increasing number of satellites is driving the growth of the radiation-hardened electronics market.

Technological Advancements Driving Innovation In Radiation-Hardened Electronics Market
Technological advancement is a key trend gaining popularity in the radiation-hardened electronics market. Major companies operating in the radiation-hardened electronics market are focused on advanced technologies to strengthen their position in the market. For instance, in July 2021, Renesas Electronics Corporation, a Japan-based semiconductor manufacturer, launched a brand-new series of radiation-hardened (rad-hard), plastic-packaged components for satellite power management systems. The ISL71001SLHM/SEHM point of load (POL) buck regulator, the ISL71610SLHM and ISL71710SLHM digital isolators, and the ISL73033SLHM 100V GaN FET and integrated low-side driver are the four new devices. These devices are all made with Giant Magneto Resistive (GMR) isolation technology, which offers better radiation tolerance than the currently available space-grade optocouplers. It combines high levels of assurance with the board area savings and cost benefits of plastic packing.

The radiation-hardened electronics market covered in this report is segmented -

1) By Product Type: Commercial-Off-The-Shelf (COTS), Custom Made
2) By Component: Power Management, Application Specific Integrated Circuit, Logic, Memory, Field-Programmable Gate Array, Other Components
3) By Manufacturing Technique: Rad-Hard By Process, Rad-Hard By Design, Rad-Hard By Software
4) By Application: Space Satellites, Commercial Satellites, Military, Aerospace and Defense, Nuclear Power Plants, Other Applications

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Major companies operating in the radiation-hardened electronics market report are Microchip Technology Inc., BAE Systems Inc., Renesas Electronics Corporation, Infineon Technologies AG, STMicroelectronics, Xilinx Inc., Texas Instruments Incorporated, Honeywell International Inc., Analog Devices Inc., Micropac Industries Inc., GSI Technology Inc., Mercury Systems Inc., Teledyne Technologies, Vorago Technologies, Maxwell Technologies, TTM Technologies Inc., International Business Machines Corporation, Data Device Corporation, Atmel Corporation, Intersil Corporation, Linear Technology Corporation, National Semiconductor Corporation, On Semiconductor Corporation, Silicon Laboratories Inc., Microsemi Corporation, X-Celeprint Limited, ABLIC Inc., Aeroflex Inc., Analogic Corporation, Crane Aerospace & Electronics

Contents of the report:
1. Executive Summary
2. Radiation-Hardened Electronics Market Report Structure
3. Radiation-Hardened Electronics Market Trends And Strategies
4. Radiation-Hardened Electronics Market - Macro Economic Scenario
5. Radiation-Hardened Electronics Market Size And Growth
…..
27. Radiation-Hardened Electronics Market Competitor Landscape And Company Profiles
28. Key Mergers And Acquisitions
29. Future Outlook and Potential Analysis
30. Appendix

Explore the report store to make a direct purchase of the report @ https://www.thebusinessresearchcompany.com/report/radiation-hardened-electronics-global-market-report

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The Business Research Company
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Asia: +91 88972 63534
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Email: info@tbrc.info

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Learn More About The Business Research Company

The Business Research Company (www.thebusinessresearchcompany.com) is a leading market intelligence firm renowned for its expertise in company, market, and consumer research. With a global presence, TBRC's consultants specialize in diverse industries such as manufacturing, healthcare, financial services, chemicals, and technology, providing unparalleled insights and strategic guidance to clients worldwide.

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