Press release
A Solution for Controlled Coefficient of Friction in Cast Polypropylene Films
Daily necessities like food and household items are indispensable in people's daily lives. As the pace of life continues to accelerate, various packaged foods and daily necessities have filled supermarkets and shopping malls, making it convenient for people to purchase, store, and use these items. Packaging materials play a crucial role in this convenience. With the continuous development of the packaging industry, automatic packaging production lines are being increasingly used in the production of food and daily necessities. As the speed and automation of packaging machines continue to increase, quality issues have also become prominent. Problems such as film breakage, slippage, production line interruptions, and package leaks are becoming more frequent, causing significant losses to many flexible packaging material manufacturers and printing companies. The main reason lies in the inability to control the friction and heat sealing properties of the automatic packaging films.Currently, the automatic packaging films on the market have the following main shortcomings:
* The outer layer of the packaging film has a low coefficient of friction (COF), while the inner layer has a high COF, causing slippage during the film run on the packaging line.
* The packaging film performs well at low temperatures but experiences issues at higher temperatures during the automatic packaging process.
* The low COF of the inner layer prevents proper positioning of the contents within the packaging film, leading to sealing failures when the heat seal strip presses on the contents.
* The packaging film performs well at low speeds but experiences poor heat sealing and leakage issues as the packaging line speed increases.
Do you understand the COF of automatic packaging film? Common anti-blocking and slip agents and challenges
The COF measures the sliding characteristics of packaging materials. The film's surface smoothness and appropriate COF are critical for the film packaging process, with different packaging material products having varying COF requirements. In actual packaging processes, friction can act as both a driving and a resisting force, necessitating effective control of the COF within an appropriate range. Generally, automatic packaging films require a relatively low COF for the inner layer and a moderate COF for the outer layer. If the inner layer COF is too low, it may cause instability and misalignment during bag forming. Conversely, if the outer layer COF is too high, it can cause excessive resistance during packaging, leading to material deformation, while too low COF can result in slippage, causing tracking and cutting inaccuracies.
The COF of composite films is influenced by the content of anti-blocking and slip agents in the inner layer, as well as the film's stiffness and smoothness. Currently, the slip agents used in inner layers are typically fatty acid amide compounds (such as primary amides, secondary amides, and bisamides). These materials are not fully soluble in polymers and tend to migrate to the film surface, reducing surface friction. However, the migration of amide slip agents in polymer films is affected by various factors, including slip agent concentration, film thickness, resin type, winding tension, storage environment, downstream processing, usage conditions, and other additives, making it difficult to ensure stable COF. Moreover, as more polymers are processed at higher temperatures, the thermal oxidative stability of slip agents becomes increasingly important. Oxidative degradation can lead to a loss of slip agent performance, discoloration, and odor.
The most common slip agents used in polyolefins are long-chain fatty acid amides, from oleamide to erucamide. The effectiveness of slip agents is due to their ability to precipitate on the film surface after extrusion. Different slip agents exhibit different rates of surface precipitation and COF reduction. As amide slip agents are low-molecular-weight migratory slip agents, their migration within the film is influenced by various factors, resulting in unstable COF. In solventless lamination processes, excessive amide slip agents in the film can cause heat sealing performance issues, commonly referred to as "blocking." The mechanism involves the migration of free isocyanate monomers in the adhesive to the film surface, reacting with the amide to form urea. Due to the high melting point of urea, this results in reduced heat sealing performance of the laminated film.
Novel non-migratory super slip & Anti-blocking agent [https://www.siliketech.com/super-slip-masterbatch/]
To address these issues, SILIKE has launched Non-precipitating Super-slip & Anti-blocking Masterbatch Additive [https://www.siliketech.com/silimer-series-super-slip-masterbatch/] - part of the SILIMER series. These modified polysiloxane products contain active organic functional groups. Their molecules include both polysiloxane chain segments and long carbon chains with active groups. The long carbon chains of active functional groups can physically or chemically bond with the base resin, anchoring the molecules and achieving easy migration without precipitation. The polysiloxane chain segments on the surface provide a smoothing effect.
Specifically, SILIMER 5065HB is designed for CPP films, and SILIMER 5064MB1 is suitable for PE-blown films and composite packaging bags. The advantages of these products include:
* SILIMER 5065HB and SILIMER 5064MB1 offer excellent anti-blocking and smoothness, resulting in a lower COF.
* SILIMER 5065HB and SILIMER 5064MB1 provide stable and permanent slip performance over time and under high-temperature conditions, without affecting printing, heat sealing, transmittance, or haze.
* SILIMER 5065HB and SILIMER 5064MB1 eliminate white powder precipitation, ensuring the integrity and aesthetics of the packaging.
*
SILIKE's SILIMER non-Blooming slip agent series provide an excellent solution for controlling the COF of automatic packaging films, from Cast Polypropylene Films, PE-blown films to Various multiple composite functional films. By addressing the migration issues of traditional slip agents and significantly improving the performance and appearance of packaging films, SILIKE offers a reliable choice for flexible packaging material manufacturers and printing companies.
Contact us Tel: +86-28-83625089 or via email: amy.wang@silike.cn
website: www.siliketech.com to learn more.
Media Contact
Company Name: Chengdu Silike Technology Co.,Ltd.
Email:Send Email [https://www.abnewswire.com/email_contact_us.php?pr=a-solution-for-controlled-coefficient-of-friction-in-cast-polypropylene-films]
Country: China
Website: https://www.siliketech.com/
This release was published on openPR.
Permanent link to this press release:
Copy
Please set a link in the press area of your homepage to this press release on openPR. openPR disclaims liability for any content contained in this release.
You can edit or delete your press release A Solution for Controlled Coefficient of Friction in Cast Polypropylene Films here
News-ID: 3593184 • Views: …
More Releases from ABNewswire

What are the most effective medical therapies for managing excess body mass? Reg …
Cape Coral healthcare providers report breakthrough success using FDA-approved GLP-1 medications for weight management, with Premier Wellness Florida leading comprehensive treatment programs combining pharmaceuticals with holistic wellness support.
Cape Coral, FL - Recent clinical developments in medical weight management have prompted Southwest Florida healthcare providers to report significant patient success rates with FDA-approved medications and comprehensive treatment protocols. Premier Wellness Florida, operating from its Del Prado Boulevard facility, has documented patient…

Winkler Kurtz LLP - Long Island Lawyers Port Jefferson Station Injury Attorney O …
Winkler Kurtz LLP is a leading Long Island law firm specializing in personal injury cases such as car accidents, slip and falls, and medical malpractice. Offering decades of local experience, the firm provides compassionate support and skilled legal advocacy to help injury victims secure justice and compensation. With free consultations and a contingency fee policy, Winkler Kurtz LLP ensures quality legal help is available to all Long Islanders in need.
When…

How to Pick the Best Online Chemistry Tutoring Platform
Image: https://www.abnewswire.com/upload/2025/10/814f4b38d9855ce5fcc0509bfebaa240.jpg
Choosing the right chemistry tutoring platform can make the difference between academic success and continued struggles with complex reactions and molecular structures. With students increasingly turning to digital solutions for personalized learning support, the online chemistry tutoring market has exploded with options promising everything from AI-powered progress tracking to virtual lab experiences that transform how learners approach this challenging subject.
Essential Platform Features for Effective Online Chemistry Tutoring
Modern chemistry tutoring…

Chronic Myeloid Leukemia Pipeline Drugs Report 2025: Emerging Therapies, Clinica …
DelveInsight's "Chronic Myeloid Leukemia Pipeline Insight 2025" report provides comprehensive insights about 20+ companies and 20+ pipeline drugs in the Chronic Myeloid Leukemia pipeline landscape. It covers the Chronic Myeloid Leukemia Pipeline drug profiles, including clinical and nonclinical stage products. It also covers the Chronic Myeloid Leukemia Pipeline Therapeutics assessment by product type, stage, route of administration, and molecule type. It further highlights the inactive pipeline products in this space.
Curious…
More Releases for COF
COF Flexible Encapsulation Substrate Market Dynamics: Emerging Trends and Innova …
COF Flexible Encapsulation Substrate Market size was valued at USD 1.5 Billion in 2024 and is projected to reach USD 4.2 Billion by 2033, exhibiting a CAGR of 12.3% from 2026 to 2033.
COF Flexible Encapsulation Substrate Market Future Scope
The COF Flexible Encapsulation Substrate Market was valued at approximately USD 950 million in 2022, and it is projected to grow at a compound annual growth rate (CAGR) of 8.2% from 2023…
Global COB-COF Compact Camera Module Market Insights, Forecast to 2029
Global Info Research announces the release of the report "Global COB-COF Compact Camera Module Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029" . This report is a detailed and comprehensive analysis of the global market, with a particular focus on future projections. The report is structured into various segments, each analyzing the competition, supply and demand trends, as well as key factors that contribute to its changing demands…
Global Chip Packaging COF Substrate Market Research Report 2023-2029
The chip packaging COF substrate is the key to the current screen transformation. The main principle is to put the display driver IC chip into the flexible FPC cable, and then use the characteristics of the FPC itself to fold it to the bottom of the screen. Specifically, through thermocompression bonding, the gold bumps of the IC chip and the inner pins on the flexible substrate circuit will be combined.…
Chip On Flex (COF) Market to See Revolutionary Growth (2023-2029)
The Latest research study released by HTF MI "Global Chip On Flex (COF) Market with 101+ pages of analysis on business Strategy taken up by key and emerging industry players and delivers know how of the current market development, landscape, technologies, drivers, opportunities, market viewpoint and status (2023-2029). The market Study is segmented by key a region that is accelerating the marketization. Understanding the segments helps in identifying the importance…
Chip On Film Underfill (COF) Market 2021 | Detailed Report
Global Chip On Film Underfill (COF) Market 2021-2027, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects in the coming years. The report includes a discussion of the key vendors operating in this market. An exclusive data offered in this report is collected by research and industry experts team.
Get Free Sample PDF (including full TOC,…
Chip On Flex (COF) Market: Competitive Dynamics & Global Outlook 2023
New report published by Market Research Report Store (MRRS) which offers insights on the global Chip On Flex (COF) market.
Chip-on-Flex, or COF, refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit (a circuit built on a flexible substrate instead of the usual printed circuit board). Thus, in a COF assembly, the microchip doesn't have to go through…