Epoxy Molding Compound in Semiconductor Packaging Market Size, Share, Scope, Revenue, Insights, Overview, Outlook, Analysis | Valuates Reports

Epoxy Molding Compound in Semiconductor Packaging Market

The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period.

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Report Scope
The Semiconductor EMC Market is expanding as a result of the soaring demand for consumer electronics including smartphones, tablets, and smart appliances. To fit the increasingly intricate and miniature semiconductor components used in these devices, they need packaging that is efficient and small. Epoxy molding materials improve the tensile strength and dependability of such devices by providing greater defense against moisture, dust, and mechanical stress. Electronic parts for advanced driver assistance systems (ADAS), entertainment, and electric vehicle technologies are proliferating as the car industry transforms. The introduction of epoxy molding compounds in the automobile sector is being driven by the demand for high-performance encapsulating materials that can survive extremely high and low temperatures as well as environmental stresses.

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Segment by Type
• Normal Epoxy Molding Compound
• Green Epoxy Molding Compound

Segment by Application
• IC
• Diode
• Transistor
• Photocoupler

By Companies
Samsung SDI, Sumitomo Bakelite, Showa Denko, Eternal Materials, Chang Chun Group, KCC, Duresco, Hysol Huawei Electronics, Jiangsu Huahai Chengkexin Material, Beijing Kehua New Materials

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