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Low Dielectric Materials Market 2024 Analysis By Size, Share, Growth, Trends Up To 2033 | Daikin Industries Ltd., Mitsubishi Corporation, Nishimura Advanced Ceramics Co Ltd
Low Dielectric Materials Global Market Report 2024
As per the report, the low dielectric materials market size has grown exponentially in recent years. It will grow from $2.04 billion in 2023 to $2.45 billion in 2024 at a compound annual growth rate (CAGR) of 20.5%. The low dielectric materials market size is expected to see exponential growth in the next few years. It will grow to $5.45 billion in 2028 at a compound annual growth rate (CAGR) of 22.1%.
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5G Revolution Boosts Low Dielectric Materials Market
The advent of 5G communications is expected to propel the growth of the low-dielectric materials market going forward. Fifth-generation wireless communication (5G) refers to the most recent cellular technology, that is designed to significantly improve the speed and responsiveness of wireless networks. Low dielectric constant resins are commonly used for manufacturing equipment such as antenna interlayers, cables, and communication devices for 5G networks. For instance, in April 2023, according to data from 5G Americas, a US-based industry trade organization, the global 5G wireless connections increased by 76% from the end of 2021 to the end of 2022, reaching up to 1.05 billion. It will touch a mark of 5.9 billion by the end of 2027. Therefore, the advent of 5G communications is driving the growth of the low dielectric materials market.
Technological Innovations Drive Growth In Low Dielectric Materials Market
New technological innovations are the key trend gaining popularity in the low dielectric materials market. Major companies operating in the market are introducing new technology products that are manufactured by using optimized electrical technology to sustain their position in the market. For instance, in November 2021, Sartomer, a US-based company that manufactures specialty UV resins and additives launched PRO14729, PRO14730, and PRO14731 which are dielectric constant (Dk) UV-curable resins that are designed for use in various electronics such as antenna elements, radomes, lenses, copper clad laminates, B-staging, server storage, and IoT applications. Optimized electrical performance technology helps to improve the performance, functionality, and speed of these electrical devices. These new ultra-low dielectric loss materials are part of growing UV-curable solutions for electronics.
The low dielectric materials market covered in this report is segmented -
1) By Type: Thermoset, Thermoplastic, Ceramics
2) By Material Type: Fluoropolymer, Modified Polyphenylene Ether, Polyimide, Cyclic Olefin Copolymer, Cyanate Ester, Liquid Crystal Polymer, Other Material Types
3) By Application: PCBs, Antenna, Microelectronics, Wire and Cable, Radome, Other Applications
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Major companies operating in the low dielectric materials market report are Daikin Industries Ltd., Mitsubishi Corporation, Nishimura Advanced Ceramics Co Ltd., Idemitsu Kosan Co Ltd., Nippon Steel & Sumitomo Metal Corporation, Saudi Basic Industries Corporation (SABIC), Applied Materials Inc., Sumitomo Chemical Co Ltd., Asahi Kasei Corporation, Shin-Etsu Chemical Co Ltd., TDK Corporation, Murata Manufacturing Co Ltd., DuPont (E.I. du Pont de Nemours and Company), Teijin Limited, Huntsman Corporation, Iwatani Corporation, The Chemours Company, Kuraray Co Ltd., Showa Denko Materials Co Ltd., JSR Corporation, Zeon Corporation, Taiyo Yuden Co Ltd., Tokai Carbon Co Ltd., Tokyo Ohka Kogyo Co Ltd., KEMET Corporation, AVX Corporation, Hindustan Fluorocarbons Limited, CeramTec GmbH, DNF Co Ltd., Gelest Inc., Vishay Intertechnology Inc.
Contents of the report:
1. Executive Summary
2. Low Dielectric Materials Market Report Structure
3. Low Dielectric Materials Market Trends And Strategies
4. Low Dielectric Materials Market - Macro Economic Scenario
5. Low Dielectric Materials Market Size And Growth
…..
27. Low Dielectric Materials Market Competitor Landscape And Company Profiles
28. Key Mergers And Acquisitions
29. Future Outlook and Potential Analysis
30. Appendix
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