Press release
Global 3D Time-of-flight Image Sensors Market Insights - Industry Share, Sales Projections, and Demand Outlook 2024-2030-Gentex Corporation,Saint-Gobain (Sage Glass),View
Market players, stakeholders, and other interested parties are the best receivers of trusted insights and strategic advice that the report provides to help them achieve their mission-critical priorities when operating in the global 3D Time-of-flight Image Sensors market. The experienced research analysts who have authored the report offer useful guidance to capitalize on market opportunities that matter the most. The guidelines offered in the report also help to find effective solutions to certain business issues related to the global 3D Time-of-flight Image Sensors market. With strong data and metrics, verified peer-driven research, and forward-thinking insights, the analysis provided in the report helps to make the right business decisions.
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3D time-of-flight (ToF) sensor is part of the 3D ToF image sensor family. The device combines ToF sensing with an optimally-designed analog-to-digital converter (ADC) and a versatile, programmable timing generator (TG).
The built-in TG controls the reset, modulation, readout, and digitization sequence. The programmability of the TG offers flexibility to optimize for various depth-sensing performance.
The global 3D Time-of-flight Image Sensors market was valued at US$ 1723 million in 2023 and is anticipated to reach US$ 6072 million by 2030, witnessing a CAGR of 20.0% during the forecast period 2024-2030.
Global 3D Time-of-flight Image Sensors key players include Texas Instruments, STMicroelectronics, PMD Technologies, Infineon, PrimeSense (Apple), etc. Global top five manufacturers hold a share about 70%.
Europe is the largest market, with a share about 40%, followed by Japan and North America, both have a share over 45 percent.
In terms of product, QVGA ToF Image Sensor is the largest segment, with a share about 50%. And in terms of application, the largest application is Consumer Electronics, followed by Robotics and Drone, Machine Vision and Industrial Automation, Entertainment, Automobile, etc.
Report Scope
This report aims to provide a comprehensive presentation of the global market for 3D Time-of-flight Image Sensors, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D Time-of-flight Image Sensors.
The 3D Time-of-flight Image Sensors market size, estimations, and forecasts are provided in terms of sales quantity (K Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global 3D Time-of-flight Image Sensors market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 3D Time-of-flight Image Sensors manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, sales, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Texas Instruments
STMicroelectronics
PMD Technologies
Infineon
PrimeSense (Apple)
MESA (Heptagon)
Melexis
ifm Electronic
Canesta (Microsoft)
Espros Photonics
TriDiCam
Segment by Type
Half-QVGA ToF Image Sensor
QVGA ToF Image Sensor
Others
Segment by Application
Consumer Electronics
Robotics and Drone
Machine Vision and Industrial Automation
Entertainment
Automobile
Others
By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E
Chapter Outline:
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, product type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: key insights, key emerging trends, etc.
Chapter 3: Manufacturers competitive analysis, detailed analysis of 3D Time-of-flight Image Sensors manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 5 & 6: Sales, revenue of 3D Time-of-flight Image Sensors in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 7: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 8: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 9: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 10: The main points and conclusions of the report.
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