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Global Semiconductor and IC Packaging Materials Market: Trends, Growth, and Future Outlook (2024-2031)

05-28-2024 07:54 AM CET | IT, New Media & Software

Press release from: DataM Intelligence 4market Research LLP

semiconductor and IC packaging materials market, valued at US$ 43.1 billion in 2023, is projected to reach US$ 93.7 billion by 20

semiconductor and IC packaging materials market, valued at US$ 43.1 billion in 2023, is projected to reach US$ 93.7 billion by 20

Market Overview

The global semiconductor and IC packaging materials market, valued at US$ 43.1 billion in 2023, is projected to reach US$ 93.7 billion by 2031, growing at a CAGR of 10.2% during the forecast period from 2024 to 2031. This growth is driven by the increasing demand for electronic hardware requiring advanced computational power, high performance, speed, and bandwidth with low latency and power consumption. Advanced packaging technologies are crucial for meeting these performance expectations and supporting the requirements of high-speed computing, artificial intelligence, and 5G technologies.

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Key Market Drivers
Technological Advancements: The rapid technological advancements in semiconductors significantly boost market demand. Key components like IC substrates, bonding wires, die attach materials, and ceramic packaging are essential for developing high-performance integrated circuits.

Increasing Demand for Consumer Electronics: The growing digitization and technological advancements are driving the demand for consumer electronics. The miniaturization of electronic devices requires integrated circuits in multi-chip modules, enhancing reliability and performance.

Government Initiatives: Government initiatives to strengthen the semiconductor industry, such as India's US$ 10 billion incentive plan, further propel market growth.

View Full Report: https://www.datamintelligence.com/research-report/semiconductor-and-ic-packaging-materials-market

Segment Analysis

The market is segmented based on type, technology, end-user, and region.

Market Segmentation
• By Type
o Organic Substrates*
o Bonding Wires
o Leadframes
o Ceramic Packages
o Die Attach Materials
o Thermal Interface Materials
o Solder Balls
o Encapsulation Resins
o Others
• By Technology
o Grid Array*
o Wafer-level Packaging
o Small-outline Package (SOP)
o Flat no-leads Packages
o Dual In-line Packages
o 3D Packaging
o Others
• By End-User
o Consumer Electronics*
o Automotive
o Healthcare
o IT & Telecommunication
o Aerospace and Defense
o Others
By Region
• North America
o U.S.
o Canada
o Mexico
• Europe
o Germany
o UK
o France
o Italy
o Spain
o Rest of Europe
• South America
o Brazil
o Argentina
o Rest of South America
• Asia-Pacific
o China
o India
o Japan
o South Korea
o Rest of Asia-Pacific
• Middle East and Africa

Geographical Penetration

North America
North America, expected to dominate with about 35% of the global market in 2023, is driven by growing investments and significant demand for semiconductor packaging materials. Major initiatives, such as Texas Instruments' plan to invest billions in U.S. semiconductor manufacturing, highlight the region's focus on strengthening its semiconductor capabilities.

Asia-Pacific
Asia-Pacific, covering more than 35% of the global market, is driven by the rising semiconductor sector, demand for high-performance ICs, and ongoing R&D initiatives by leading manufacturers. Countries like Taiwan and Japan have significant contributions due to their strong semiconductor industries and technological advancements.

Competitive Landscape
The major global players in the market include Intel, Amkor Technology, Deca Technologies, Siemens, Samsung, Advanced Semiconductor Engineering Inc, Taiwan Semiconductor Manufacturing Company, Microchip Technology, Synapse Electronique, and FlipChip International LLC.

Key Developments
June 2021: Samsung revealed an updated collection of chipsets for next-generation 5G solutions, including Compact Macro, Massive MIMO radios, and baseband units.
February 2021: Siemens Digital Industries Software and Advanced Semiconductor Engineering, Inc. announced their collaboration to analyze complex integrated circuit package assemblies.
Market Challenges

COVID-19 Impact
The COVID-19 pandemic compelled manufacturing industries to adopt digital transformation and smart manufacturing practices, significantly impacting the semiconductor industry. Despite a year-on-year drop in 2023, a rapid recovery is projected for 2024.

Russia-Ukraine War Impact
The Russia-Ukraine conflict poses potential threats to the semiconductor supply chain, particularly concerning the supply of essential raw materials like neon and palladium. The conflict exacerbates existing chip shortages, impacting industries reliant on semiconductors.

Related Reports:

https://www.datamintelligence.com/research-report/semiconductor-packaging-market
https://www.datamintelligence.com/research-report/semiconductor-manufacturing-equipment-market
https://www.datamintelligence.com/research-report/electronic-packaging-market

Contact Us -
Company Name: DataM Intelligence
Contact Person: Sai Kiran
Email: Sai.k@datamintelligence.com
Phone: +1 877 441 4866

DataM Intelligence 4Market Research is a market intelligence platform that gives access to syndicated, customized reports and consulting to its clients in one place. As a firm with rich experience in research and consulting across multiple domains, we are a one-stop solution that will cater to the needs of clients in key business areas. DataM Intelligence has an online platform whose industries such as chemicals and materials, agriculture, health care services, animal feed, and food & beverages, among others. Our platform has Insights on markets that uncover the latest market research data that are distinct from the competition. With coverage across 10 major industries in the marketplace research, DataM Intelligence benefits thousands of companies by helping them take their innovations early to the market by providing a complete view of the market with statistical forecasts. Our strategy-centric framework and value-added services will let individuals and corporations ease access and custom personalization to research and markets.

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