Press release
Global Copper Foil for PCB Industry Research Report, Growth Trends and Competitive Analysis 2024-2030
The global Copper Foil for PCB market size was US$ 3953.2 million in 2023 and is forecast to a readjusted size of US$ 5113.5 million by 2030 with a CAGR of 3.7% during the forecast period 2024-2030.
Copper foil for PCB market has several key players, like Kingboard Holdings Limited, Nan Ya Plastics Corporation, Chang Chun Group and Mitsui Mining & Smelting, they take a market share 58.8% in Value in 2018. Global giant manufactures mainly distributed in Asia-Pacific.
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In terms of production side, this report researches the Copper Foil for PCB capacity, production, growth rate, market share by manufacturers, region level and country level, from 2019 to 2024, and forecast to 2030.
In terms of sales (consumption) side, this report focuses on the sales of Copper Foil for PCB by region (Countries), company, type and application. from 2019 to 2024 and forecast to 2030.
The global Copper Foil for PCB market is thoroughly, accurately, and comprehensively assessed in the report with a large focus on market dynamics, market competition, regional growth, segmental analysis, and key growth strategies. Buyers of the report will have access to verified market figures, including global market size in terms of revenue and volume. As part of production analysis, the authors of the report have provided reliable estimations and calculations for global revenue and volume by type segment of the global Copper Foil for PCB market. These figures have been provided in terms of both revenue and volume for the period 2019-2030. Additionally, the report provides accurate figures for production by region in terms of revenue as well as volume for the same period. The report also includes production capacity statistics for the same period.
Market Segmentation
By Company
Kingboard Holdings Limited
Nan Ya Plastics Corporation
Chang Chun Group
Mitsui Mining & Smelting
Tongling Nonferrous Metal Group
Furukawa Electric
Co-Tech
JX Nippon Mining & Metal
Jinbao Electronics
LYCT
Fukuda
Guangdong Chaohua Technology Co.,Ltd.
Hitachi Cable
Olin Brass
NUODE
Iljin Materials
Guangdong Jia Yuan Technology Shares Co., Ltd.
By Type
By Type
Electrolytic Copper Foil
Rolled Copper Foil
By Copper Thickness
Less than 10 um
11-30um
31-50um
More than 51um
By Application
Single-sided Board
Double-sided & Multi-layer Board
Others
Production by Region
North America
Europe
China
Japan
Taiwan
South Korea
Sales by Region
North America
U.S.
Canada
China
APAC (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
Europe
Germany
France
U.K.
Italy
Russia
Middle East, Africa, Latin America
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by type and by application, etc.), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Sales (consumption), revenue of Copper Foil for PCB in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 3: Copper Foil for PCB production/output of global and key producers (regions/countries). It provides a quantitative analysis of the production, and development potential of each producer in the next six years.
Chapter 4: Detailed analysis of Copper Foil for PCB manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments by type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America by company, by type, by application and by country, sales, and revenue for each segment.
Chapter 8: Europe by company, by type, by application and by country, sales, and revenue for each segment.
Chapter 9: China by company, by type and by application, sales, and revenue for each segment.
Chapter 10: APAC (excluding China) by company, by type, by application and by region, sales, and revenue for each segment.
Chapter 11: Middle East, Africa, and Latin America by company, by type, by application and by country, sales, and revenue for each segment.
Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Copper Foil for PCB sales, revenue, price, gross margin, and recent development, etc.
Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors, and customers.
Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.
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