Semiconductor Assembly and Packaging Services Market Size, Revenue, Insights, Overview, Outlook, Analysis | Valuates Reports

Semiconductor Assembly and Packaging Services Market Size

The global Semiconductor Assembly and Packaging Services market was valued at US$ 6419.4 million in 2023 and is anticipated to reach US$ 8553.4 million by 2030, witnessing a CAGR of 4.1% during the forecast period 2024-2030.

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Semiconductor assembly and packaging services are crucial in the semiconductor production process. The package of the semiconductor device is usually made of materials such as plastic, metal, and ceramic/glass. Packaging is undertaken to provide protection against impact and corrosion.

Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.

This report aims to provide a comprehensive presentation of the global market for Semiconductor Assembly and Packaging Services, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Assembly and Packaging Services.

By Type
• Assembly Services
• Packaging Services

By Application
• Telecommunications
• Automotive
• Aerospace and Defense
• Medical Devices
• Consumer Electronics

Key Players
Advanced Semiconductor Engineering (ASE), Amkor Technology, Intel, Samsung Electronics, SPIL, TSMC

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