Epoxy Resin Molding Compound Market Size, Revenue, Insights, Overview, Outlook, Analysis | Valuates Reports

According to new survey, global Epoxy Resin Molding Compound market is projected to reach US$ 2816 million in 2029, increasing from US$ 2178 million in 2022, with the CAGR of 3.7% during the period of 2023 to 2029.

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EMC (Epoxy Molding Compound) is a semi-conductor encapsulant which is used in most products where semi-conductors are applied, such as general home appliances including mobile phones, refrigerators and TVs, industrial devices and vehicles. With the development of IT technology and the development of electronic products based on modern technologies, the global semi-conductor market is expanding and the EMC demand is increasing.

Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Epoxy Resin Molding Compound market research.

Asia-Pacific is the largest Epoxy Molding Compounds market with about 86% market share. North America is follower, accounting for about 6% market share.The industry's leading producers are Sumitomo Bakelite, Showa Denko and Chang Chun Group, which accounted for 20%, 10% and 4% of revenue.In terms of product, solid EMC is the largest segment, with a share about 80%. And in terms of application, the largest application is non-memory, followed by discrete.

By Type

Ordinary Epoxy Molding Compound
Green Epoxy Molding Compoun

By Application
Semiconductor Packaging
Electronic Component

Key Companies
Sumitomo Bakelite, Hitachi Chemical, Chang Chun Group, Hysol Huawei Electronics, Panasonic, Kyocera, KCC, Samsung SDI, Eternal Materials, Jiangsu Zhongpeng New Material, Shin-Etsu Chemical, Hexion, Nepes, Tianjin Kaihua Insulating Material, HHCK, Scienchem, Beijing Sino-tech Electronic Material

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This release was published on openPR.