Press release
Fan-Out Wafer Level Packaging Market: Industry Size, Share, Consumption, Trends, Analysis And Forecast To 2033
Fan-Out Wafer Level Packaging Market
The fan-out wafer level packaging market size is expected to see rapid growth in the next few years. It will grow to $3.94 billion in 2028 at a compound annual growth rate (CAGR) of 12.8%. The growth in the forecast period can be attributed to 5g and iot growth, artificial intelligence (ai) and high-performance computing, advances in materials, supply chain growth. Major trends in the forecast period include 3d integration, advanced packaging technologies, heterogeneous integration, cross-industry collaboration.
Market Overview -
Fan-Out WLP (FOWLP) refers to a technological improvement to regular wafer-level packages (WLPs) designed to provide a solution for semiconductor devices requiring a higher integration level and more significant external contacts. It has a lower package footprint, more input/output (I/O) and better thermal and electrical performance. It has various advantages and can increase the number of connections without increasing the die size.
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5G Technology Expansion Fuels Growth In The Fan-Out Wafer-Level Packaging Market
5G technology adoption in emerging countries is expected to propel the growth of the fan-out wafer-level packaging market in the coming future. 5G is the fifth generation of cellular network technology designed to increase speed, reduce latency and improve the flexibility of wireless services. Fan-out wafer-level packaging helps 5G technology by providing shorter interconnects and reduced inductance, enhancing RF and millimeter-wave performance. For instance, in April 2023, according to 5G Americas, a US-based trade association representing major telecom companies, between the end of 2021 and the end of 2022, global 5G wireless internet connections ascended by 76%, reaching 1.05 billion. Further, North America leads the way in wireless 5G connection adoption, reaching 507 million Volte and 119 million 5G connections expected by the end of the fourth quarter of 2022. Therefore, 5G technology adoption in emerging countries is driving the fan-out wafer-level packaging market.
Competitive Landscape -
Major players in the fan-out wafer level packaging market are Samsung Electronics Co. Ltd., Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, Qualcomm Inc., Fujitsu Limited, Toshiba Corporation, Applied Materials Inc., ASE Technology Holding Co. Ltd., Texas Instruments Incorporated, Lam Research Corporation, STMicroelectronics N.V., Infineon Technologies AG, NXP Semiconductors N.V., Analog Devices Inc., Renesas Electronics Corporation, United Microelectronics Corporation, GlobalFoundries Inc., Amkor Technology Inc., Microchip Technology Inc., Synopsys Inc., Xilinx Inc., Siliconware Precision Industries Co Ltd., Onto Innovation Inc., Unisem Group, Nepes Corporation, Deca Technologies Inc., Yield Engineering Systems Inc., Powertech Technology Inc., Jiangsu Changdian Technology Co. Ltd., Yole Group.
Leading Companies Embrace Next-Generation Graphics Dram Technology For Enhanced Customer Services
Major companies operating in the fan-out wafer-level packaging market are focusing on advanced next-generation graphics DRAM technology to provide reliable services to customers. Next-generation graphics DRAM technology refers to evolving and improving memory components specifically designed for graphics processing units (GPUs) and other graphics-intensive applications. For instance, in November 2022, Samsung Electronics Co. Ltd., a South Korea-based consumer electronics company, launched GDDR6W, the industry's first next-generation graphics DRAM technology with doubled capacity and performance based on cutting-edge fan-out wafer-level packaging (FOWLP) technology. This significantly increases memory bandwidth and capacity with immense performance, massive storage and extensive bandwidth memory technologies that are assisting in bringing the virtual realm closer to reality.
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Key Segments -
The fan-out wafer level packaging market covered in this report is segmented -
1) By Process Type: Standard-Density Packaging; High-Density Packaging; Bumping
2) By Business Model: Outsourced Semiconductor Assembly and Test (OSAT); Foundry; Integrated Device Manufacturer (IDM)
3) By Application: Consumer Electronics; Industrial; Automotive; Healthcare; Aerospace And Defense; IT And Telecommunication; Other Applications
Key highlights covered in the report -
1. Detailed market size forecast and historical data analysis
2. Key drivers influencing market growth
3. Identification of upcoming trends and potential opportunities in the market
4. Analysis of major players strategies, to understand competitive dynamics and market positioning
5. Evaluation of regional dynamics
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