Wafer UV Film and Non-UV Film (Blue Film) Market Revenue, Insights, Overview, Outlook, Analysis | Valuates Reports

According to new survey, global Wafer UV Film and Non-UV Film (Blue Film) market is projected to reach US$ 434.8 million in 2029, increasing from US$ 351 million in 2022, with the CAGR of 3.1% during the period of 2023 to 2029.

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Before the wafer is thinned, a layer of adhesive film will be pasted on the front of the wafer. The function of this layer of film is to fix the chip on the front of the wafer, so that the grinding machine can grind the silicon wafer on the back of the wafer. Generally, the thickness of the silicon wafer before grinding is about 700 μm. After grinding, the thickness of the wafer becomes 200 μm, or even reaches the level of 120 μm. It depends on the customer's requirements and the application environment of the chip, that is, the wafer thinning process. Wafer will stick a layer of film on the back of Wafer before slicing. The function of this film is to stick the chip on the film, which can keep the grain intact during the cutting process and reduce the chipping during the cutting process. Ensure that the die will not be displaced and dropped during the normal transfer process, that is, the scribing process in the post-chip packaging and testing process. A film used to fix Wafer and chip is used in chip thinning and dicing process. In the actual production process, this kind of film generally uses UV film and non-UV film (blue film)

Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.

By Type
• UV Film
• Non-UV Film

By Application
• Back Grinding
• Wafer Dicing

Key Companies
Mitsui Chemicals Tohcello, LINTEC, Denka, Nitto, Furukawa Electric, Sumitomo Bakelite, D&X, AI Technology, ULTRON SYSTEM, maxell, NDS, KGK Chemical, NEXTECK, Suzhou BoYan Jingjin Photoelectric, WISE new material, Vistaic

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This release was published on openPR.