Press release
Thermal Interface Materials Global Market Estimated to Surge at a CAGR of 11.9% to Reach $4.47 Billion By 2028 | Universal Science, Dymax Corporation, Ellsworth Adhesives, GELID Solutions Ltd., Master Bond Inc.
Thermal Interface Materials Global Market
The thermal interface materials market size is expected to see rapid growth in the next few years. It will grow to $4.47 billion in 2028 at a compound annual growth rate (CAGR) of 11.9%. The growth in the forecast period can be attributed to electric vehicle proliferation, renewable energy technologies, medical device innovations, climate change concerns, ai and iot expansion. . Major trends in the forecast period include advanced bonding technologies, thermal gap fillers, innovations in tim packaging , thermal management simulation, nanomaterial integration..
Market Overview -
Thermal interface materials are defined as materials made from conducting materials such as metals, silicon, and metal oxides and are applied between hard surfaces for conducting heat. Thermal interface materials find their applications mainly in electronics, medical devices, and industrial machinery.
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Rising Demand For Electronic Devices Drives Growth In The Thermal Interface Materials Market
The increasing demand for electronic devices is anticipated to boost the demand for the thermal interface materials market over the coming years. Electronic devices are devices that use electrical energy to perform various functions, such as computing, communication, or control. Thermal interface materials are used in electronic devices, such as tablets, computers, smartphones, and video games, for their thermal conductive properties that help in strengthening the efficiency and life of electronic devices is expected to contribute to market growth. For instance, in May 2023, according to the Japan Electronics and Information Technology Industries Association, a Japan-based trade association, the total electronic equipment production in Japan reached $52,36,535 million (¥771,457 million). In addition, consumer electronics production reached $2,178,430 million (¥32,099 million) in May 2023, compared to $1,714,724 million (¥25,268 million) in May 2022. Therefore, the surge in demand for electronic devices and appliances is expected to generate higher revenues for the thermal interface materials market.
Competitive Landscape -
Major companies operating in the thermal interface materials market include The 3M Company, Zalman Tech Co. Ltd., Wakefield-Vette Inc., Indium Corporation, The Berquist Company Inc., Momentive Performance Materials Inc., Laird Technologies Inc., DOW Corning Corporation, Parker Hannifin Corporation, Henkel AG & Co. KGAA, Fujipoly Industries Co Ltd., DK Thermal Metal Circuit Technology Ltd., AI Technology Inc., AIM Specialty Materials, AOS Thermal Compounds LLC., Denka Company Limited., Universal Science, Dymax Corporation, Ellsworth Adhesives, Enerdyne Devices Private Limited., European Thermodynamics Ltd, Inkron Oy, Kitagawa Industries, LORD, M. A. Electronics Private Limited., MH&W International Corporation., Minerals Technologies Inc., Chomerics Inc., Robnor ResinLab Ltd., Schlegel Electronics Materials, Shin-Etsu Chemical Co. Ltd., Honeywell International Inc., Panasonic Corporation, Advanced Thermal Solutions Inc., MG Chemicals, Thermal Grizzly, Aavid Thermalloy LLC, Arctic Silver Inc., Thermalright Inc., Cooler Master Co. Ltd., GELID Solutions Ltd., Master Bond Inc., Kerafol Keramische Folien GmbH & Co. KG
Product Innovation Enhanced Thermal Interface Material Market Expansion
Major companies operating in the thermal interface materials market focus on product innovation. The innovation involves development and implementation of new or improved technologies, materials, or designs that enhance heat transfer efficiency and reliability in electronic devices. For instance, in January 2023, Electrolube, a UK-based advanced solutions company for engineering and technology, launched the new GF600 thermal gap filler. GF600 is a two-part, liquid silicone-based gap filler that provides excellent thermal performance and can be cured at room temperature or accelerated with heat.
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Key Segments -
The thermal interface materials market covered in this report is segmented -
1) By Type: Greases & Adhesives, Tapes & Films, Gap Fillers, Metal-Based TIMs, Phase Change Materials, Other Types
2) By Chemistry: Silicone, Epoxy, Polyimide, Other Chemistries
3) By Application: Telecom, Computer, Medical Devices, Industrial Machinery, Consumer Durables, Automotive Electronics, Other Applications
Key highlights covered in the report -
1. Detailed market size forecast and historical data analysis
2. Key drivers influencing market growth
3. Identification of upcoming trends and potential opportunities in the market
4. Analysis of major players strategies, to understand competitive dynamics and market positioning
5. Evaluation of regional dynamics
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