Press release
Outsourced Semiconductor Assembly And Testing Global Market Overview, Driving Factors, Future Trends, Key Players and Growth Opportunities And Forecast By 2033
Outsourced Semiconductor Assembly And Testing Market
The outsourced semiconductor assembly and testing market size is expected to see strong growth in the next few years. It will grow to $63.46 billion in 2028 at a compound annual growth rate (CAGR) of 9.9%. The growth in the forecast period can be attributed to automotive industry, cybersecurity, global supply chain, outsourced manufacturing, environmental regulations. Major trends in the forecast period include 3d ic technology, 5g technology, artificial intelligence (ai) and machine learning, high-performance computing, advanced packaging.
Market Overview -
The outsourced semiconductor assembly and testing refer to a third-party service comprising semiconductor assembly, packaging, and testing of ICs (integrated circuits). The outsourced semiconductor assembly and testing (OSAT) services are offered by vendors/suppliers that are contracted by semiconductor design companies.
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Surging Demand For Consumer Electronics Boosts Outsourced Semiconductor Assembly And Testing Market
The growing demand for consumer electronics is expected to propel the growth of the outsourced semiconductor assembly and testing market. The demand for consumer electronics is growing due to high disposable income, changing lifestyle of customers, growing middle-class population, and falling electronics prices. Outsourced semiconductor assembly and testing is an essential process to pass through before the use of these consumer electronics as well as it is a low-cost and innovative solution that enables electronic devices to increase performance, processing speeds, and usefulness while occupying less space. For instance, in May 2023, according to the Japan Electronics and Information Technology Industries Association, a Japan-based trade association, the total electronic equipment production in Japan accounted for $6,722 million (¥771,457 million). In addition, consumer electronics production reached $280 million (¥ 32,099 million) in May 2023, compared to $230.9 million (¥25,268 million) in May 2022. , Thus, a rise in demand for consumer electronics will drive the outsourced semiconductor assembly and testing market..
Competitive Landscape -
Major companies operating in the outsourced semiconductor assembly and testing market include Advanced Semiconductor Engineering Inc., Amkor Technology Inc., Jiangsu Changjiang Electronics Tech Co. Ltd., King Yuan Electronics Co. Ltd., Alphacore Inc., Device Engineering Inc., HMT microelectronic AG, Luminar Technologies Inc., Presto Engineering Group, Sencio BV, ShortLink AB, SiFive Inc., Powertech Technology Inc., Tianshui Huatian Technology Co. Ltd., Nantong Fujitsu Microelectronics Co. Ltd., UTAC Holdings Ltd., Chipbond Technology Corporation, ChipMOS Technologies Inc., Huatian Technology Sdn. Bhd., Walton Advanced Engineering Inc., Signetics Corporation, Hana Micron Inc., NEPES Corporation, Sunrise Memory Corp., Tongfu Microelectronics Co. Ltd., Integrated Micro-electronics Inc., Formosa Advanced Technologies Co Ltd., Lingsen Precision Industries Ltd., Shenzhen CPET Electronics Co. Ltd., Bharat Electronics Limited
Strategic Partnerships Driving Innovation In The Outsourced Semiconductor Assembly And Testing (OSAT) Market
The strategic partnership is a key trend in the outsourced semiconductor assembly and testing (OSAT) market. The technology/software companies are entering into a partnership with OSAT companies to develop new design platforms and technological enablement for next-generation advanced package designs. These partnerships are aimed at leveraging each other's expertise and resources as well as gaining a competitive edge in the market. For instance, in February 2021, Siemens Digital Industries Software Inc., a US-based company focused on developing 3D and 2D product lifecycle management tools, extended its partnership with Advanced Semiconductor Engineering Inc. (ASE), a Taiwan-based independent semiconductor assembling and test manufacturing services company. The partnership has been focusing on developing enablement technologies for next-generation high-density advanced package designs. The extended partnership will focus on the future development of a single design platform utilizing Siemens' Xpedition Substrate Integrator software and Calibre 3DSTACK platform.
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Key Segments -
The outsourced semiconductor assembly and testing market covered in this report is segmented -
1) By Type: Test Service, Assembly Service
2) By Process: Sawing, Sorting, Testing, Assembly
3) By Packaging Type: Ball Grid Array, Chip Scale Package, Multi Package, Stacked Die, Quad And Dual
4) By Application: Communication, Consumer Electronics, Computing And Networking, Automotive, Industrial, Other Applications
Key highlights covered in the report -
1. Detailed market size forecast and historical data analysis
2. Key drivers influencing market growth
3. Identification of upcoming trends and potential opportunities in the market
4. Analysis of major players strategies, to understand competitive dynamics and market positioning
5. Evaluation of regional dynamics
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