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Global Organic Substrate Packaging Material Market 2024 : Trends, Business Growth And Major Driving Factors | Amkor Technology Inc., Advanced Semiconductor Engineering Inc., Compass Technology Co. Ltd., Hitachi Chemical Company Ltd
Organic Substrate Packaging Material Global Market Report 2024
The organic substrate packaging material market size is expected to see strong growth in the next few years. It will grow to $18.53 billion in 2028 at a compound annual growth rate (CAGR) of 5.4%. The growth in the forecast period can be attributed to electric vehicle market growth, circular economy initiatives, stringent environmental regulations, rising consumer electronics trends, supply chain resilience. Major trends in the forecast period include integration of nanotechnology in packaging, expansion of applications in healthcare, innovation in material compositions, demand for high-performance and cost-effective solutions, next-gen technologies.
Market Overview -
Organic substrate packaging material is a highly reliable and fine design rule used in semiconductor packaging. They are used as a foundation layer in the semiconductor.
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The Role Of Organic Substrate Packaging Materials In The Surge Of Self-Driving Vehicles
The increasing adoption of self-driving vehicles is expected to propel the organic substrate packaging material market growth going forward. The self-driving vehicles also known as autonomous car refers to a vehicle that is capable of sensing their surroundings and operating without human interaction. The self-driving vehicles require semiconductors for processing and sensing the captured data. The increasing use of semiconductors will increase the demand for the packaging of the semiconductors, which eventually will increase the demand for organic substrate packaging materials. For instance, in 2021, according to a report published by the SMMT, the trade association for the United Kingdom motor industry, connected and autonomous vehicles (CAVs), will boost the UK economy to £62 billion by 2030 and, there will 1 in every 5 miles will be traveled by self-driving vehicles while preventing 47,000+ accidents. Further, according to American Automobile Association, a US-based privately held not-for-profit national member association and service organization, 72% of U.S. adults feel safer in a self-driving car if they can take over the car. Therefore, the increasing adoption of self-driving vehicles is driving the growth of the organic substrate packaging material market.
Competitive Landscape -
Major companies operating in the organic substrate packaging material market report are Amkor Technology Inc., Advanced Semiconductor Engineering Inc., Compass Technology Co. Ltd., Hitachi Chemical Company Ltd., Mitsubishi Corporation, STATS ChipPAC Pte Ltd., NGK Spark Plug Co. Ltd., Shinko Electric Industries Co. Ltd., Showa Denko KK, Kyocera Corporation, WUS Printed Circuit Co. Ltd., Ajinomoto Group, Microchip Technology Inc., Texas Instruments Incorporated, Unimicron Technology Corporation, Ibiden Co. Ltd., AT&S Austria Technologie & Systemtechnik AG, Samsung Electro-Mechanics Co. Ltd., Amcor plc, Fujikura Ltd., Nippon Mektron Ltd., Tripod Technology Corporation, Compeq Manufacturing Co. Ltd., HannStar Board Corporation, Kingboard Chemical Holdings Ltd., Sumitomo Bakelite Co. Ltd., Panasonic Corporation, Nitto Denko Corporation, Rogers Corporation, Shenzhen Kinwong Electronic Co. Ltd., Unitech Printed Circuit Board Corporation, Young Poong Electronics Co. Ltd., CMK Corporation, Daeduck GDS Co. Ltd., Dynamic Electronics Co. Ltd., Flexium Interconnect Inc., Fujitsu Interconnect Technologies Ltd., Interflex Co. Ltd., LG Innotek Co. Ltd., Multek Corporation
Advancements In Technology Drive The Organic Substrate Packaging Material Market
Technological advancements are a key trend gaining popularity in the organic substrate packaging material market. Major companies operating in the organic substrate packaging material market are focused on developing new technological solutions to strengthen their position. For instance, in June 2021, Panasonic Holdings Corporation, a Japan-based provider of industrial products and solutions including capacitors, packaging, and sensors, launched a new substrate packaging material, R-1515V, which is expected to improve assembly-level reliability and lower the package warpage. Its optimized mechanical properties lower the residual stress on solder joints, created during reflow assembly, to improve the reliability of IC chips. The new material will allow addressing the critical challenge with the IC chips packaging process by lower thermal expansion.
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Key Segments -
The organic substrate packaging material market covered in this report is segmented -
1) By Technology: Small Outline (SO) Packages, Grid Array (GA) Packages, Flat No-Leads Packages, Quad Flat Package (QFP), Dual In-Line Package (DIP), Other Technologies
2) By Application: Consumer Electronics, Automotive, Manufacturing, Healthcare, Other Applications
3) By End-Use: Mobile Phones, FPD (Flat Panel Display), Other End-Uses
Key highlights covered in the report -
1. Detailed market size forecast and historical data analysis
2. Key drivers influencing market growth
3. Identification of upcoming trends and potential opportunities in the market
4. Analysis of major players strategies, to understand competitive dynamics and market positioning
5. Evaluation of regional dynamics
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