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Integrated Passive Devices Market Growth, Trends & Analysis 2024-2033 | Size, Share & Forecast

Integrated Passive Devices Market

Integrated Passive Devices Market

The integrated passive devices market size has grown rapidly in recent years. It will grow from $1.63 billion in 2023 to $1.81 billion in 2024 at a compound annual growth rate (CAGR) of 10.6%. The growth in the historic period can be attributed to miniaturization in electronics, wireless technology advancements, rapid growth in consumer electronics, demand for improved performance, cost and space efficiency..

The integrated passive devices market size is expected to see rapid growth in the next few years. It will grow to $2.67 billion in 2028 at a compound annual growth rate (CAGR) of 10.2%. The growth in the forecast period can be attributed to iot expansion, expansion of smart home technology, technological innovation in medical devices, increased connectivity needs, demand for automotive electronics.. Major trends in the forecast period include emergence of wearable technology, demand for energy-efficient solutions, transition to higher frequencies, cost and space efficiency..

Market Overview -
Integrated passive devices refer to devices that are completely integrated and installed on a semiconducting substrate and comprise passive circuit components like resistors, inductors, and capacitors. It is utilized in a variety of applications including aerospace and defense, wireless, and test and measurement.

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Smartphone Boom Fuels Growth In Integrated Passive Devices Market
The increasing demand for smartphones is expected to boost the growth of the integrated passive devices market going forward. A smartphone refers to a portable electronic device that connects to the internet and cellular networks. The smartphone GPS tracking system needs an integrated passive device to track location and record information. Hence the increasing demand for smartphones will increase the demand for integrated passive devices. For instance, according to a report published in January 2022 by the Consumer Technology Association (CTA), a US-based trade association representing consumer technology companies, smartphone sales in 2022 were expected to reach 154.1 million units, a 3% increase from 149.6 million units in 2021. Therefore, increasing demand for smartphones is driving the growth of the integrated passive devices market.

Competitive Landscape -
Major companies operating in the integrated passive devices market report are Infineion Technologies AG, STMicroelectronics N.V., Murata Manufacturing Co. Ltd., Johanson Technology Inc., OnChip Devices Inc., STATS ChipPAC Corp., ON Semiconductor Corp., Infineon AG, Global Communication Semiconductors, Advanced Furnace Systems, Broadcom Inc., Skyworks Solutions Inc., Texas Instruments Inc., Micron Technology Inc., NXP Semiconductors NV, Vishay Intertechnology Inc., TDK Corporation, Taiyo Yuden Co. Ltd., AVX Corporation, Samsung Electro-Mechanics Co. Ltd., Panasonic Corporation, Yageo Corporation, Walsin Technology Corporation, Chilisin Electronics Corp., Coilcraft Inc., Pulse Electronics Corp., Token Electronics Industry Co. Ltd., Integrated Passive Component Technologies Corp., KEMET Corporation, Maxim Integrated Products Inc., Renesas Electronics Corporation .

Technological Advancements Redefining Integrated Passive Devices Market
Technological advancement is the key trend gaining popularity in the integrated passive devices market. Major companies operating in the integrated passive devices market are focusing on developing new technologies to sustain their market position. For instance, in September 2023, X-FAB Silicon Foundries SE, a Germany-based fabrication provider for analog and mixed-signal integrated circuits, launched the XIPD process, an integrated passive device (IPD) fabrication capability. The innovative technology offers significant advantages over traditional surface-mount or discrete passive components by significantly reducing the size of semiconductor devices, leading to smaller and more compact electronic systems. Integrating passive components directly into the chip, XIPD can reduce the overall cost of semiconductor manufacturing. The XIPD process is based on X-FAB's XR013 130nm RF SOI process and utilizes an engineered substrate with a thick copper metallization layer.

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Key Segments -
The integrated passive devices market covered in this report is segmented -
1) By Material: Silicon, Glass, Other Materials
2) By Passive Devices: Baluns, Filter, Couplers, Diplexers, Customized Integrated Passive Devices, Other Passive Devices
3) By Packaging: Wire Bonding, Single In-Line Package (SIL), Quad Flat No Lead (QFN), Chip-Scale Package, Wafer Level Package, Other Packagings
4) By Application: Electrostatic Discharge (ESD) Or Electromagnetic interference (EMI), RF Integrated Passive Device, Digital And Mixed Signals, Other Applications
5) By End-Use: Consumer Electronics, Automotive, Communication, Aerospace And Defence, Healthcare And Life Sciences

Key highlights covered in the report -
1. Detailed market size forecast and historical data analysis
2. Key drivers influencing market growth
3. Identification of upcoming trends and potential opportunities in the market
4. Analysis of major players strategies, to understand competitive dynamics and market positioning
5. Evaluation of regional dynamics

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