Chemical Mechanical Polishing Machine (CMP) Market Research Report 2024 | Valuates Reports

The global Chemical Mechanical Polishing Machine (CMP) market was valued at US$ 2855.3 million in 2023 and is anticipated to reach US$ 6171.2 million by 2030, witnessing a CAGR of 11.5% during the forecast period 2024-2030.

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Chemical Mechanical Polishing is more commonly known as CMP Polishing. This is the process where the top surface of a wafer is polished with a slurry containing an abrasive grit, suspended within reactive chemical agents. The polishing action is partly mechanical and partly chemical. The mechanical element of the process applies downward pressure while the chemical reaction that takes place increases the material removal rate and this is usually tailored to suit the type of material being processed.

Global core chemical mechanical polishing machine (CMP) manufacturers include Applied Materials and Ebara Corporation etc. The top 2 companies hold a share about 80%. Asia-Pacific is the largest market, with a share about 75%, followed by North America with the share about 13%.

This report aims to provide a comprehensive presentation of the global market for Chemical Mechanical Polishing Machine (CMP), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chemical Mechanical Polishing Machine (CMP).

By Type
• 300MM Polishing Machine
• 200MM Polishing Machine

By Application
• Semiconductor Plants
• Research Institutes

Key Companies
Applied Materials, Ebara Corporation, KC Tech, ACCRETECH, Tianjin Huahaiqingke, Logitech, Revasum, Alpsitec

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