Power Module Packaging Market Size to Boost USD 4.67 Billion By 2032 | CAGR 9.7 % - Published by Emergen Research

The global power module packaging market size was USD 1.68 billion in 2022 and is expected to register a steady revenue CAGR of 9.7 % during the forecast period, according to latest analysis by Emergen Research. Rapid demand for power module packaging technology in autonomous vehicles and Electric Vehicles (EVs) is a key factor driving market revenue growth. A power electronic module acts as a physical container for storage of several power components, usually power semiconductor devices. Globally, several Hybrid-Electric Vehicles (HEV), Plug-In Hybrid-Electric Vehicles (PHEV), and Electric Vehicles (EV) Original Equipment Manufacturers (OEMs) players are incorporating Silicon Carbide (SiC) and Gallium Nitride (GaN)-based power modules to elevate overall safety and performance standards of EV batteries.

Advancement in Si. Gallium Nitride (GaN)-based innovative power electronic components for high-voltage applications, such as charging and e-drivetrain, is another key factor driving revenue growth of the market. Prominent players in the power module packaging market are collaborating with power semiconductor companies to co-develop high-voltage battery disconnection technologies by leveraging capabilities of GaN power switches.

The report is attuned with the latest market changes and economic landscape with regard to the currently unfolding COVID-19 pandemic. The crisis has affected the demand and supply pattern, as well as the trends of the industry. It has also brought an economic slowdown that has affected the business of the key manufacturers of the industry. The report estimates the impact of this crisis on the current scenario and future prospects and provides a post-COVID market scenario.

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Drivers of Growth in the Power Module Packaging Market
Several factors are propelling the growth of the Power Module Packaging Market. One of the primary drivers is the burgeoning demand for energy-efficient solutions and the increasing focus on renewable energy sources. As governments worldwide implement stringent regulations to curb greenhouse gas emissions, there is a growing emphasis on the adoption of power electronics for renewable energy generation and grid integration. Moreover, the proliferation of electric vehicles (EVs) and hybrid electric vehicles (HEVs) is boosting the demand for power module packaging, as these vehicles rely heavily on power electronic systems for efficient energy management and propulsion.

Restraints and Challenges in the Power Module Packaging Market

Despite the promising growth prospects, the Power Module Packaging Market faces certain restraints and challenges. One of the key challenges is the complexity involved in designing and manufacturing advanced power module packages that meet the stringent performance and reliability requirements of modern applications. Additionally, the high cost associated with the development and integration of power module packaging solutions poses a significant barrier, particularly for small and medium-sized enterprises (SMEs) operating in cost-sensitive markets. Furthermore, issues related to thermal management and thermal cycling reliability continue to pose challenges for power module packaging designers and manufacturers.
The report also discusses the key players involved in the market such as:

SEMIKRON Elektronik GmbH & Co. KG Mitsubishi Electric Corporation Infineon Technologies AG Sanken Electric Co., Ltd. Vincotech GmbH SCHOTT AG NXP Semiconductors N.V. Dynex Semiconductor Ltd. Vicor Corporation KYOCERA AVX Components (Salzburg) GmbH Onsemi STMicroelectronics N.V. ASE Technology Holding Co, Ltd. Amkor Technology, Inc.

The report provides a thorough estimation of the overall impact of the pandemic on the Power Module Packaging Market and its vital segments. The report also discusses the impact of the pandemic across different regions of the market. It also offers a current and future assessment of the impact of the pandemic on the Power Module Packaging Market

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For the purpose of this report, Emergen Research has segmented the global power module packaging market on the basis of power module type, technology, thermal type, end-use, and region:

• Power Module Type Outlook (Revenue, USD Billion; 2019-2032)
o Silicon Carbide (SiC)) Module
o Gallium Nitride (GaN) Module
o Insulated-Gate Bipolar Transistor (IGBT) Module
o Field-Effect Transistor (FET) Module
o Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) Module
o Others

• Technology Outlook (Revenue, USD Billion; 2019-2032)
o Standard Packaging
o Advanced Packaging
o Pressure-Contact Modules
o Others

• Thermal Type Outlook (Revenue, USD Billion; 2019-2032)
o Liquid-Cooled
o Air-Cooled
o Hybrid

• End-use Outlook (Revenue, USD Billion; 2019-2032)
o Manufacturing
o Automotive
o Consumer Electronics
o Telecommunications
o Aerospace and Defense
o Renewable Energy
o Others

• Regional Outlook (Revenue, USD Billion; 2019-2032)
o North America
1. U.S.
2. Canada
3. Mexico
o Europe
1. Germany
2. France
3. UK
4. Italy
5. Spain
6. Benelux
7. Rest of Europe
o Asia Pacific
1. China
2. India
3. Japan
4. South Korea
5. Rest of APAC
o Latin America
1. Brazil
2. Rest of LATAM
o Middle East & Africa
1. Saudi Arabia
2. UAE
3. South Africa
4. Turkey
5. Rest of Middle East & Africa

Browse Full Report Description + Research Methodology + Table of Content + Infographics @ https://www.emergenresearch.com/industry-report/power-module-packaging-market

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