FC BGA Market Size, Revenue, Insights, Overview, Outlook, Analysis | Valuates Reports

FC BGA market was valued at US$ 4369 million in 2022 and is anticipated to reach US$ 6530.4 million by 2029, witnessing a CAGR of 5.6% during the forecast period 2023-2029.

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Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection technology, also known as flip chip, for its die to substrate interconnection. FC BGA provides the design flexibility for much higher signal density and functionality into a smaller die and packaging footprint. FC BGA packaging is attractive where performance is more important than cost. Flip-chip BGA packages can be mounted using standard printed circuit boards and can be replaced using existing standard repair practices.

The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

Global key players of FC BGA (ABF (Ajinomoto Build-up Film) Substrate) include Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, etc. The top five players hold a share over 68%. Asia-Pacific is the largest market, has a share about 77%, followed by North America and Europe, with share 13% and 7%, separately. In terms of product type, 4-8 Layers ABF Substrate is the largest segment, occupied for a share of 75%, and in terms of application, PCs has a share about 57 percent.

By Type
• 4-8 Layers ABF Substrate
• 8-16 Layers ABF Substrate

By Application
• PCs
• Server & Data Center
• HPC/AI Chips
• Communication

Key Players
Unimicron, Ibiden, Nan Ya PCB, Shinko Electric Industries, Kinsus Interconnect, AT&S, Semco, Kyocera, TOPPAN, Zhen Ding Technology, Daeduck Electronics, ASE Material, ACCESS, NCAP China, LG InnoTek, Shennan Circuit, Shenzhen Fastprint Circuit Tech

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