Press release
Global Low Temperature Thermosetting Structural Adhesive Market Research Report 2024
Leading players of the global Low Temperature Thermosetting Structural Adhesive market are analyzed taking into account their market share, recent developments, new product launches, partnerships, mergers or acquisitions, and markets served. We also provide an exhaustive analysis of their product portfolios to explore the products and applications they concentrate on when operating in the global Low Temperature Thermosetting Structural Adhesive market. Furthermore, the report offers two separate market forecasts - one for the production side and another for the consumption side of the global Low Temperature Thermosetting Structural Adhesive market. It also provides useful recommendations for new as well as established players of the global Low Temperature Thermosetting Structural Adhesive market.
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Low-temperature thermosetting structural adhesive is a one-component, fast-curing modified epoxy adhesive. It is designed specifically for CSP (FBGA) or BGA and is a reworkable underfill. This glue can form a consistent and defect-free underfill layer, effectively reducing the impact caused by the thermal expansion coefficient mismatch between the chip and the substrate or external forces, thereby improving product reliability1. Low-temperature thermosetting glue usually refers to epoxy resin glue that is heated and cured under lower temperature conditions (such as 60 degrees, 70 degrees, 80 degrees), and is suitable for certain precision electronic components or LED components that are not resistant to high temperatures.
The global Low Temperature Thermosetting Structural Adhesive market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030.
North American market for Low Temperature Thermosetting Structural Adhesive is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Low Temperature Thermosetting Structural Adhesive is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global manufacturers of Low Temperature Thermosetting Structural Adhesive include Henkel, 3M, Sika, Huntsman Corporation, LORD Corporation, H.B. Fuller, Permabond, ITW Performance Polymers, Master Bond, Panacol-Elosol, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Low Temperature Thermosetting Structural Adhesive, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Low Temperature Thermosetting Structural Adhesive.
The Low Temperature Thermosetting Structural Adhesive market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Low Temperature Thermosetting Structural Adhesive market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Low Temperature Thermosetting Structural Adhesive manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Henkel
3M
Sika
Huntsman Corporation
LORD Corporation
H.B. Fuller
Permabond
ITW Performance Polymers
Master Bond
Panacol-Elosol
Pidilite Industries
Dymax Corporation
Chemence
Techsil Limited
Budnick Converting
Protavic America
Bostik
Copps Industries, Inc.
Dexerials
by Type
Epoxy Glue
Polyurethane Glue
Acrylic Glue
by Application
Consumer Electronics Industry
Aerospace Industry
Machinery Industry
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Low Temperature Thermosetting Structural Adhesive manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Low Temperature Thermosetting Structural Adhesive by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Low Temperature Thermosetting Structural Adhesive in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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QYResearch is a leading global market research and consulting company established in 2007. With over 16 years' experience and professional research team in various cities over the world QY Research focuses on management consulting, database and seminar services, IPO consulting, industry chain research and customized research to help our clients in providing non-linear revenue model and make them successful. We are globally recognized for our expansive portfolio of services, good corporate citizenship, and our strong commitment to sustainability.
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