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Chiplets Market Report 2024 : Strategies And Recent Developments | Samsung Electronics, Taiwan Semiconductor Manufacturing Company, Intel Corporation, IBM
Chiplets Global Market Report 2024
The Business Research Company presents an extensive market research report on the Chiplets Global Market Report 2024, furnishing businesses with a competitive edge through a detailed examination of the market structure, encompassing estimates for various segments and sub-segments.
Furthermore, the report highlights on emerging trends, significant drivers, challenges, and opportunities, providing all necessary data for thriving in the industry. This report market research offers a comprehensive perspective, including an in-depth analysis of the present and future scenarios within the industry.
Market Sizing:
The chiplets market size has grown exponentially in recent years. It will grow from $4.44 billion in 2023 to $7.8 billion in 2024 at a compound annual growth rate (CAGR) of 75.8%. The growth in the historic period can be attributed to semiconductor industry growth, healthcare sector expansion, electronics manufacturing, stringent regulatory standards, globalization of supply chains.
The chiplets market size is expected to see exponential growth in the next few years. It will grow to $64.4 billion in 2028 at a compound annual growth rate (CAGR) of 69.5%. The growth in the forecast period can be attributed to growing biopharmaceutical industry, increasing demand in the food industry, advanced manufacturing techniques, global health concerns, stricter environmental regulations. Major trends in the forecast period include increased research and development activities, rising nanotechnology applications, technological advancements, technological advancements in cleanroom equipment, growing biotechnology and life sciences research.
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Key Market Players:
Major companies operating in the chiplets market report are Samsung Electronics, Taiwan Semiconductor Manufacturing Company, Intel Corporation, IBM, Qualcomm Technologies Inc., NVIDIA Corporation, Micron Technology Inc., Advanced Micro Devices Inc., ASE Technology Holding Co. Ltd., MediaTek Inc., NXP Semiconductors N.V., United Microelectronics Corporation, GlobalFoundries, Synopsys Inc., Marvell Technology Inc., Cadence Design Systems Inc., Xilinx Inc., ALPHAWAVE SEMI, Tenstorrent, Ayar Labs Inc., Kandou Bus SA, SiFive Inc., Achronix Semiconductor Corporation, Ranovus, Netronome, X-Celeprint, NHanced Semiconductors, Rain Neuromorphics, Eliyan, Chipuller
Market Drivers:
Rising demand for electronic gadgets is expected to propel the chiplets market going forward. Electronic gadgets refer to devices or tools that utilize electronic components and technology to perform specific functions. Chiplets provide a more adaptable, economical, and scalable method of creating and producing electronic gadgets, meeting the growing complexity and needs of contemporary technologies. For instance, in May 2023, according to the Japan Electronics and Information Technology Industries Association, a Japan-based trade association, consumer electronics production reached $2,178,430 million (¥32,099 million) in May 2023, compared to $1,714,724 million (¥25,268 million) in May 2022. Furthermore, in February 2023, according to Uswitch Limited, a UK-based financial conduct authority, beginning in 2022, there were 71.8 million mobile connections in the UK, a 3.8% (or around 2.6 million) increase over 2021. The UK population is expected to grow to 68.3 million by 2025, of which 95% (or around 65 million individuals) own a smartphone. Therefore, the rising demand for electronic gadgets rate is driving the chiplets market.
Learn More About The Market Report -
https://www.thebusinessresearchcompany.com/report/chiplets-global-market-report
The chiplets market covered in this report is segmented -
1) By Processor: Field Programmable Gate Array (FPGA), Graphics Processing Unit (GPU), Central Processing Unit (CPU), Application Processing Unit (APU), Artificial Intelligence Application-specific Integrated Circuit (AI ASIC) Coprocessor
2) By Packaging Technology: System-in-Package (SiP), Flip Chip Chip Scale Package (FCCSP), Flip Chip Ball Grid Array (FCBGA), 2.5D/3D, Wafer-Level Chip Scale Package (WLCSP), Fan-Out (FO)
3) By End-User: Enterprise Electronics, Consumer Electronics, Industrial Automation, Healthcare, Automotive, Military and Aerospace, Others End-Use
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