Outsourced Semiconductor Assembly and Test (OSAT) Market : Size, Share, Growth, Analysis, Key Players, Revenue, Growth | Valuates Reports

Outsourced Semiconductor Assembly and Test (OSAT) Market Size
The global Outsourced Semiconductor Assembly and Test (OSAT) market was valued at US$ 63140 million in 2022 and is anticipated to reach US$ 85590 million by 2029, witnessing a CAGR of 5.2% during the forecast period 2023-2029.

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Outsourced Semiconductor Assembly and Test (OSAT) Market
OSAT stands for Outsourced Semiconductor Assembly and Test. This report focuses on OSAT Providers. Outsourced Semiconductor Assembly and Test (manufacturing) provide third-party IC-packaging and test services.The OSATs are merchant vendors. IDMs and foundries with internal packaging operations also outsource a certain percentage of their IC-packaging production to the OSATs. The fabless companies also outsource their packaging to the OSATs and/or foundries.
The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Global Outsourced Semiconductor Assembly and Test (OSAT) key players include ASE Group, Amkor, JECT, SPIL, etc. Global top four manufacturers hold a share over 30%.
United States is the largest market, with a share about 30%, followed by China, and China Taiwan, both have a share about 35 percent.
In terms of product, Assembly Service is the largest segment, with a share about 80%. And in terms of application, the largest application is Communications, followed by Automotive, Computing, Consumer, etc.

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Segment by Type
• Test Service
• Assembly Service

Segment by Application
• Communications
• Automotive
• Computing
• Consumer
• Others

By Company
ASE Group, Amkor, JECT, SPIL, Powertech Technology Inc, TSHT, TFME, UTAC, Chipbond, ChipMOS, KYEC, Unisem, Walton Advanced Engineering, Signetics, Hana Micron, NEPES

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