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Advanced Packaging Technologies Market Report 2024 - Market Size, Growth Rate, Major Drivers And Key Trends | Samsung Electronics, Taiwan Semiconductor Manufacturing Company, Intel Corporation, International Business Machines
Advanced Packaging Technologies Global Market Report
The Business Research Company offers in-depth market insights through Advanced Packaging Technologies Global Market Report 2024, providing businesses with a competitive advantage by thoroughly analyzing the market structure, including estimates for numerous segments and sub-segments.
Market Size And Growth Forecast:
The advanced packaging technologies market size has grown rapidly in recent years. It will grow from $6.46 billion in 2023 to $7.3 billion in 2024 at a compound annual growth rate (CAGR) of 12.9%. The growth in the historic period can be attributed to consumer electronics growth, mobile computing, enhanced thermal management, automotive electronics, environmental considerations.
The advanced packaging technologies market size is expected to see rapid growth in the next few years. It will grow to $12.33 billion in 2028 at a compound annual growth rate (CAGR) of 14.0%. The growth in the forecast period can be attributed to heterogeneous integration, quantum computing, flexible and stretchable electronics, supply chain resilience, smart manufacturing. Major trends in the forecast period include advanced interconnect technologies, fan-out wafer-level packaging, system-in-package, thermal management solutions, embedded packaging for IoT devices.
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Market Segmentation:
The advanced packaging technologies market covered in this report is segmented -
1) By Type: 3D Integrated Circuit, 2D Integrated Circuit, 2.5D Integrated Circuit, Other Types
2) By Product: Active Packaging, Smart And Intelligent Packaging
3) By End Use Industry: Automotive And Transport, Consumer Electronics, Industrial, IT And Telecommunication, Other End Use Industries
Major Driver - Surging Consumer Electronics Demand Fuels Growth In The Advanced Packaging Market
Growing demand for consumer electronics is expected to propel the growth of the advanced packaging market going forward. Consumer electronics refers to any electronic equipment, gadgets, or devices made to be purchased and used on a regular basis for non-commercial or professional purposes by consumers. Consumer electronics can create demand for advanced packaging as it plays an important role in defining the sophistication of the products. For instance, in June 2021, Oberlo, a Lithuania-based e-commerce platform, said that globally, 6.4 billion people use smartphones. Therefore, the growing demand for consumer electronics is driving the growth of the advanced packaging market.
Competitive Landscape:
Major companies operating in the advanced packaging technologies market report are Samsung Electronics, Taiwan Semiconductor Manufacturing Company, Intel Corporation, International Business Machines, Qualcomm Technologies, Advanced Semiconductor Engineering (ASE), ASE Technology Holding Co. Ltd., Texas Instruments, Shin-Etsu Chemical Co. Ltd., Renesas Electronics Corporation, GlobalFoundries Inc., Sanmina Corporation, Amkor Technology, Jiangsu Changjiang Electronics Technology, STATS ChipPAC, Tongfu Microelectronics, Powertech Technology, ChipMOS Technologies Inc., United Test and Assembly Center Holdings Ltd., Unisem (M) Berhad., Greatek Electronics, Nepes Corporation, SFA Semicon, SÜSS Microtec, China WLCSP Co. LTD., Universal Instruments Corporation, Brewer Science, Chipbond Technology Corporation, Deca Technologies, Siliconware Precision Industries, Silicon Mobility SAS., Lam Research Corporation, Toshiba Electronic Devices & Storage Corporation, King Yuan Electronics Co. Ltd., Semiconductor Manufacturing International Corporation, Chip One Stop Inc., Jiangsu Changjiang Electronics Technology Co. Ltd., Hana Micron Inc., IBIDEN Engineering CO. LTD., Aehr Test Systems
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Top Trend - Glass Substrates Revolutionizing Advanced Packaging Technologies
Major companies operating in the advanced packaging technologies market are increasing their focus on introducing high-performance glass substrates to gain a competitive edge in the market. Glass substrates are flat, rigid sheets or panels made of glass that serve as a base or foundation for various electronic devices, displays, sensors, or other technologies that require a smooth and transparent surface. For instance, in June 2023, Intel Corporation, a US-based technology company, unveiled glass substrates for advanced packaging that are expected to offer several advantages for the company. These glass substrates can tolerate higher temperatures, offer 50% less pattern distortion, and have ultra-low flatness for improved depth of focus. Compared to organic substrates, glass offers improved properties such as ultra-low flatness and better thermal and mechanical properties, resulting in much higher interconnect density in a substrate.
The Table Of Content For The Market Report Include:
1. Executive Summary
2. Advanced Packaging Technologies Market Characteristics
3. Advanced Packaging Technologies Market Trends And Strategies
4. Advanced Packaging Technologies Market - Macro Economic Scenario
5. Advanced Packaging Technologies Market Size And Growth
…..
27. Advanced Packaging Technologies Market Competitor Landscape And Company Profiles
28. Key Mergers And Acquisitions
29. Future Outlook and Potential Analysis
30. Appendix
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