Wafer Processing Equipment Market Upcoming Trends Estimated to Reach $14.4 Billion by 2031

Wafer processing equipment are used to convert semiconductors such as crystalline silicon germanium, and gallium arsenide into thin round slices, which can be used as a substrate for microelectronic devices. The wafer processing includes activities such as formation, texturing, cleaning, dicing and etching.

The wafers offer unique high-temperature capability, better expandability, stability, and better peel strength which is growing its adoption for electronic devices manufacturing applications. However, the electronic market in North America is affected due to trade war between China and the U.S. that has resulted in decrease in sales of wafers and China is the major exporter of wafers in the U.S. that has affected the growth of the wafer processing equipment market.

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Driving Factors:
Wafer Processing Equipment Market was valued at $8.5 billion in 2021, and is estimated to reach $14.4 billion by 2031, growing at a CAGR of 5.3% from 2022 to 2031.

The evolution of smaller electronic components for designing the light weighted electronic products is expected to offer new opportunities for the market that could be responsible for growing the wafer processing equipment market size.

However, the introduction of vaccines for coronavirus disease and the re-initiation of production facilities is anticipated to provide lucrative opportunities for the wafer's players. Region wise, the global wafer processing equipment market analysis is conducted across North America (the U.S., Canada, and Mexico), Europe (the UK, France, Germany, Italy, and Rest of Europe), Asia-Pacific (China, Japan, India, South Korea, and Rest of Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa). Europe region is expected to dominate the wafer processing equipment market throughout the study period.

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Top Players:
The major players having significant wafer processing equipment market share listed in the report are Applied Materials, Inc, DISCO, Hitachi Kokusai Linear, KLA Corporation, Lam Research Corporation, Motorola Solutions, Inc., Nikon Corporation, Plasma-Therm, Spts Technologies Ltd and Tokyo Electron Limited.

Key Segments:

Based on process, the etch segment held the major market share in 2021, holding more than two-fifths of the global wafer processing equipment market share, and is expected to maintain its leadership status during the forecast period. However, the mass metrology segment, is expected to cite the fastest CAGR of 5.7% during the forecast period.

On the basis of application, the dicing segment held the largest market share in 2021, accounting for nearly one-third of the global wafer processing equipment market share, and is expected to maintain its leadership status during the forecast period. Nevertheless, the cleaning segment, is expected to cite the highest CAGR of 6.8% during the forecast period.

In terms of end user, the computer segment held the largest market share in 2021, accounting for one-third of the global wafer processing equipment market share. Furthermore, the same segment is expected to maintain its leadership status during the forecast period. Nevertheless, the communication segment, is expected to cite the highest CAGR of 5.4% during the forecast period.

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