Solder Materials Market to show Robust Growth in Upcoming Years by 2024-2033

The Business Research Company has updated its global market reports, featuring the latest data for 2024 and projections up to 2033

The Business Research Company presents an extensive market research report on the Solder Materials Global Market Report 2024, furnishing businesses with a competitive edge through a detailed examination of the market structure, encompassing estimates for various segments and sub-segments.

Furthermore, the report highlights on emerging trends, significant drivers, challenges, and opportunities, providing all necessary data for thriving in the industry. This report market research offers a comprehensive perspective, including an in-depth analysis of the present and future scenarios within the industry.

Market Sizing:

The solder materials market size has grown steadily in recent years. It will grow from $2.03 billion in 2023 to $2.12 billion in 2024 at a compound annual growth rate (CAGR) of 4.5%. The growth in the historic period can be attributed to rise in renewable energy electronics, reliability and durability, automotive applications, miniaturization in electronics..

The solder materials market size is expected to see steady growth in the next few years. It will grow to $2.55 billion in 2028 at a compound annual growth rate (CAGR) of 4.7%. The growth in the forecast period can be attributed to supply chain resilience, circular economy initiatives, aerospace and defense applications, advanced medical electronics.. Major trends in the forecast period include industry 4.0 and smart manufacturing, advancements in manufacturing processes, high-speed and high-frequency electronics, sustainable and green solder materials..

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Key Market Players:

Major companies operating in the solder materials market report are Lucas-Milhaupt Inc., Henkel AG & Co. KGaA, Senju Metal Industries Co. Ltd., Koki Company Limited, Indium Corporation, Kester, Alpha Assembly Solutions, Nihon Superior Co. Ltd., Heraeus Holding GmbH, AIM Metals & Alloys LP, Qualitek International Inc., FCT Assembly Inc., Tamura Corporation, DUKSAN Hi-Metal Co. Ltd., Balver Zinn Josef Jost GmbH & Co. KG, MG Chemicals Ltd., Nihon Handa Denki Co. Ltd., Nihon Genma Manufacturing Co. Ltd., Nihon Almit Co. Ltd., Yashida Corporation, Tongfang Tech Co. Ltd., Shenzhen Bright Technology Development Co. Ltd., Shenzhen Jufeng Solder Co. Ltd., Shenzhen Xinqiao Automation Co. Ltd., The Indium Corporation, Indium Corporation, Eutectic Gold/Tin Solder, Liquid Metal - Gallium and Gallium Alloys, NC-10HF Flux Coating for Solder Preforms, Nitinol Soldering Kit, No-Clean Fluxes for Coating Solder Preform

Market Drivers:

The increase in demand from the electronic industry is expected to propel the solder materials market. The electronics industry refers to businesses that create, design, manufacture, and sell equipment such as radios, televisions, stereos, computers, semiconductors, transistors, integrated circuits, and more. Solder is used in the electronic industry to produce a mechanical and electrical joint required to maintain components in the circuit. For instance, in January 2022, according to a vision document published by the Ministry of Electronics and Information Technology, an executive agency of the Union Government of the Republic of India, the electronics industry is anticipated to rise from an estimated US$15 billion in 2021-2022 to US$120 billion by 2026, showing a significant demand for electronics. Therefore, increasing demand from the electronic industry is driving the solder materials market.

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The solder materials market covered in this report is segmented -

1) By Product: Wire, Paste, Bar, Flux, Others
2) By Process: Wave/Reflow, Robotic, Screen Printing, Laser
3) By End-Use Industry: Consumer Electronics, Automotive, Industrial, Building, Others

The report answers the following questions:
What are the primary factors propelling the market during the projected period?

In which region is the most substantial growth expected?

Which trend will take center stage in the upcoming period?

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