Molded Interconnect Device (MID) Market 2024: Size, Share, Trends, and Demand Insights - Navigating Global Challenges for Competitive Growth and Outlook Until 2033

The Business Research Company has updated its global market reports, featuring the latest data for 2024 and projections up to 2033

The Business Research Company presents an extensive market research report on the Molded Interconnect Device (MID) Global Market Report 2024, furnishing businesses with a competitive edge through a detailed examination of the market structure, encompassing estimates for various segments and sub-segments.

Furthermore, the report highlights on emerging trends, significant drivers, challenges, and opportunities, providing all necessary data for thriving in the industry. This report market research offers a comprehensive perspective, including an in-depth analysis of the present and future scenarios within the industry.

Market Sizing:

The molded interconnect device (mid) market size has grown rapidly in recent years. It will grow from $1.51 billion in 2023 to $1.77 billion in 2024 at a compound annual growth rate (CAGR) of 17.2%. The growth in the historic period can be attributed to miniaturization trends, consumer electronics evolution, automotive electronics development, medical device innovations, shift towards smart manufacturing..

The molded interconnect device (mid) market size is expected to see rapid growth in the next few years. It will grow to $3.27 billion in 2028 at a compound annual growth rate (CAGR) of 16.5%. The growth in the forecast period can be attributed to ongoing evolution of consumer electronics, rise in medical device integration, automotive electronics growth, rapid prototyping and manufacturing innovations.. Major trends in the forecast period include regulatory compliance and quality standards, customization and design flexibility, rapid prototyping and manufacturing technologies, sustainability and material innovations, industry 4.0 and smart manufacturing..

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Key Market Players:

Major companies operating in the molded interconnect device (mid) market report are Molex LLC, TE Connectivity Ltd., Amphenol Corporation, LPKF Laser & Electronics AG, 2E mechatronic GmbH & Co. KG, Harting Technologiegruppe, Arlington Plating Company, MID Solutions LLC, MacDermid Inc., JOHNAN Corporation, TactoTek Oy, Axon' Cable S.A.S, S2P Solutions, Suzhou Cicor Technology Co. Ltd, Chogori Technology Co. Ltd., Mitsubishi Engineering-Plastics Corporation, Galtronics Corporation Ltd., RTP Company, BASF SE, EMS-Chemie Holding AG, Ensinger GmbH, Zeon Corporation, SelectConnect Technologies, Multiple Dimensions AG, Cicor Group, Tesa SE, APC Automotive Technologies LLC, Yomura Technologies Inc., T-Ink Inc., ODU GmbH & Co. KG

Market Drivers:

Growing demand for IoT devices is expected to propel the growth of the molded interconnect devices market going forward. IoT devices refer to the billions of physical items or things linked to the internet, all of which gather and exchange data with other devices and systems over the internet. The rising demand for the Internet of Things (IoT), quantum computing, and 5G, among other emerging technology segments, combined with the connected world's increasing demand for higher computational speed and efficiency, low-power devices, and intelligent chipsets, has had a significant impact on the semiconductor & electronics industry dynamics. For instance, in August 2022, according to a blog released by Techjury, collected from IoT Analytics. The categories with the most real corporate IoT initiatives in development included Smart City (23%), Connected Industry (17%), and Connected Building (12%) and 97% of firms believe that producing value from IoT-related data is challenging. Therefore, the growing demand for IoT devices will drive the molded to interconnect devices market.

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The molded interconnect device (mid) market covered in this report is segmented -

1) By Product: Antenna and Connectivity Modules, Connectors and Switches, Sensors, Lighting
2) By Process: Laser Direct Structuring (LDS), Two-shot molding, Other Processes
3) By Application: Automotive, Consumer products, Healthcare, Industrial, Military and aerospace, Telecommunication And Computing

The report answers the following questions:

What are the primary factors propelling the market during the projected period?

In which region is the most substantial growth expected?

Which trend will take center stage in the upcoming period?

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