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Wafer Debonding System Market Revenue, Insights, Overview, Outlook, Analysis | Valuates Reports
Within the wafer debonder, the processed temporary bonding wafer stack is separated and cleaned, with the fragile device wafer always supported throughout the whole tool. Supported debonding methods include UV laser, thermal and mechanical debonding etc.The global Wafer Debonding System market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
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North American market for Wafer Debonding System is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Wafer Debonding System is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Wafer Debonding System include Tokyo Electron Limited, SUSS MicroTec Group, EV Group, Cost Effective Equipment, Micro Materials, Dynatech co., Ltd., Alpha Plasma and Nutrim, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
By Company
• Tokyo Electron Limited
• SUSS MicroTec Group
• EV Group
• Cost Effective Equipment
• Micro Materials
• Dynatech co., Ltd.
• Alpha Plasma
• Nutrim
Segment by Type
• Thermal Debond
• Mechanical Debond
• Laser Debond
• Jetting Debond
Segment by Application
• MEMS
• Advanced Packaging
• CMOS
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