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Wafer Bonder Market Revenue, Insights, Overview, Outlook, Analysis | Valuates Reports
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The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The global wafer bonding machine market is relatively concentrated, and the major manufacturers in the international market include EV Group, SUSS MicroTec, Tokyo Electron, AML, Mitsubishi, Ayumi Industry, SMEE, etc. Austria EV Group is the world's leading enterprise, accounting for 55.05% of the global revenue in 2019. Germany's SUSS MicroTec is the second largest company in the world, accounting for 21.62% of the global market.Tokyo Electron, AML, Mitsubishi, Ayumi Industry and SMEE together have a market share of nearly 20%.
By Type
• Semi-Automated Wafer Bonder
• Automated Wafer Bonder
By Application
• MEMS
• Advanced Packaging
• CMOS
Key Players
EV Group, SUSS MicroTec, Tokyo Electron, AML, Mitsubishi, Ayumi Industry, SMEE
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