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Wafer Bonder Market Revenue, Insights, Overview, Outlook, Analysis | Valuates Reports

12-25-2023 12:10 PM CET | Advertising, Media Consulting, Marketing Research

Press release from: Valuates Reports

Wafer Bonder Market Revenue, Insights, Overview, Outlook,

Wafer Bonder market was valued at US$ 137.8 million in 2022 and is anticipated to reach US$ 233 million by 2029, witnessing a CAGR of 7.7% during the forecast period 2023-2029.

Get Free Sample: https://reports.valuates.com/request/sample/QYRE-Auto-32O8894/Global_Wafer_Bonder_Market_Outlook_2022

The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.

The global wafer bonding machine market is relatively concentrated, and the major manufacturers in the international market include EV Group, SUSS MicroTec, Tokyo Electron, AML, Mitsubishi, Ayumi Industry, SMEE, etc. Austria EV Group is the world's leading enterprise, accounting for 55.05% of the global revenue in 2019. Germany's SUSS MicroTec is the second largest company in the world, accounting for 21.62% of the global market.Tokyo Electron, AML, Mitsubishi, Ayumi Industry and SMEE together have a market share of nearly 20%.

By Type
• Semi-Automated Wafer Bonder
• Automated Wafer Bonder

By Application
• MEMS
• Advanced Packaging
• CMOS

Key Players

EV Group, SUSS MicroTec, Tokyo Electron, AML, Mitsubishi, Ayumi Industry, SMEE

View Full Report: https://reports.valuates.com/market-reports/QYRE-Auto-32O8894/global-wafer-bonder

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