SiC Wafer Polishing Market worth $2.2 billion by 2028 | Key players Kemet International (UK), Entegris (US), Iljin Diamond (US), Fujimi Corporation (Japan), and Saint-Gobain (US).

According to recent market research the "SiC Wafer Polishing Market by Product Type (Abrasive Powders, Polishing Pads, Diamond Slurries, Colloidal Silica Suspensions), application, Process, & Region (North America, Europe, APAC, South America, MEA) - Global Forecast 2028", is expected to grow at a CAGR of 37.5% during the forecast period, from an estimated USD 0.4 billion in 2023 to USD 2.2 billion by 2028. Growing Consumption of Consumer Electronics, Growing demand for SIC-based power devices, Development of advanced polishing consumables, and Adoption of SiC wafers in radio frequency (RF) devices provide growth opportunities for Sic wafer polishing Market.

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Power electronics has the greatest market share in the SiC wafer polishing business, owing to the rapid expansion and demand for energy-efficient electronic gadgets. SiC wafers have distinct advantages in this field, such as strong thermal conductivity and a broad bandgap, making them ideal for power electronic components that require superior performance at high temperatures. With the increasing adoption of electric vehicles, renewable energy systems, and industrial applications, the need for high-power SiC-based devices has increased dramatically.

Chemical Mechanical Polishing (CMP) has dominated the SiC wafer polishing market due to its unique ability to provide a highly regulated and exact polishing process. CMP combines chemical reactions with mechanical abrasion to provide better planarization and surface smoothness on SiC wafers, which are required for high-performance semiconductor devices. Its success is also related to its compatibility with diverse SiC substrate types and its capacity to handle larger wafer sizes, answering the semiconductor industry's aspirations for advanced applications. Furthermore, CMP's efficacy in eliminating faults and impurities from SiC wafers makes it a favored alternative for producing reliable and high-quality devices. As a result of these benefits, CMP has the fastest-growing market share in the SiC wafer polishing market, becoming the market leader.

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The Asia Pacific region is experiencing the fastest growth in the SiC wafer polishing market due to its increasing adoption of emerging technologies such as 5G, IoT, and AI, along with a thriving consumer electronics market, robust industrial and automotive sectors, and the presence of established semiconductor manufacturers and technology companies. These factors, combined with a growing focus on renewable energy and electric vehicle technologies, have fueled the demand for polished SiC wafers in the region, making it the dominant and rapidly expanding market in the global SiC wafer polishing industry.

To enable an in-depth understanding of the competitive landscape, the report includes the profiles of some of the top players in the Sic wafer polishing Market. These are Kemet International (UK), Entegris (US), Iljin Diamond (US), Fujimi Corporation (Japan), and Saint-Gobain (US).

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The company Fujimi, Inc. produces and sells synthetic precision abrasives. Japan, North America, Asia, and Europe are the four geographic divisions through which the company conducts business. Its offerings include chemical mechanical planarization (CMP) materials necessary for multi-layered circuits on semiconductor chips, polishing abrasives for silicon wafers and other semiconductor substrates, and abrasives for computer hard drives. Additionally, it provides thermal spray abrasives for airplanes, semiconductors, steel, and energy turbines, as well as specialty abrasives for electronic components, lights, vehicles, and lenses. The company's headquarters are in Kiyosu, Japan, and it was established in August 1950. In 2022, the company had a revenue of USD 439.84 million.

Ferro Corporation is a multinational corporation that manufactures materials and chemicals for a variety of industries, including the semiconductor and electronics industries. Ferro, founded in 1919, has developed to become a major provider of innovative electronic materials solutions. The headquarters of the corporation are in Mayfield Heights, Ohio, in the United States. Ferro works globally from this strategic location, supplying customers in varied markets across the world. Ferro, which focuses on the semiconductor and electronics industries, has a diverse product line that includes Chemical Mechanical Planarization (CMP) slurries. CMP slurries are critical in the fabrication of integrated circuits (ICs) because they are used to polish and planarize the semiconductor wafer surfaces. Geographically, the company classifies its revenue into three segments, such as EMEA, the US, Asia Pacific, and Latin America. In FY2021, EMEA contributed 43.2% of the company's total revenue, followed by Americas (41.9%), and Asia Pacific (14.8%).

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