Semiconductor Assembly And Packaging Equipment market competitive and growth analysis - major players, high growth strategies and opportunities

As per The Business Research Company's Semiconductor Assembly And Packaging Equipment Opportunities And Strategies Market Report 2023, The global semiconductor assembly and packaging equipment market reached a value of nearly $10,399.4 million in 2022, having grown at a compound annual growth rate (CAGR) of 8.7% since 2017. The market is expected to grow from $10,399.4 million in 2022 to $18,508.8 million in 2027 at a rate of 12.2%. The market is then expected to grow at a CAGR of 12.1% from 2027 and reach $32,709.2 million in 2032.

The rise in demand for electric vehicles (EVs) across the world will contribute to the growth of the semiconductor assembly and packaging equipment market in the forecast period. Semiconductors are the most important part of electric vehicles. The aggregate value of semiconductors used in an electric vehicle is more than twice that of an internal combustion engine. Semiconductors make it possible for electric cars to be efficient, interactive and safe. Thus, an increase in demand for EVs will increase the demand for semiconductors. For example, the National Institution for Transforming India (NITI) Aayog, India based state-of-the-art resource center, projected EVs to supply 30% of new private car sales in India, 70% of commercial cars, 40% of buses and 80% of two and three-wheelers by 2030, driven by Faster Adoption and Manufacturing of Hybrid and Electric Vehicles (FAME II), and other measures. This amounts to having 80 million electric vehicles on the road by 2030.

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Companies in the semiconductor assembly and packaging equipment market are focusing on the launch of new semiconductor inspection machines using big data and AI. Artificial intelligence (AI) refers to the simulation of human intelligence in machines that are programmed to think like humans and mimic their actions.

The top opportunities in the semiconductor assembly and packaging equipment market segmented by type will arise in the inspection and dicing equipment segment, which will gain $2,956.3 million of global annual sales by 2027. The top opportunities in the semiconductor assembly and packaging equipment market segmented by application will arise in the consumer electronics segment, which will gain $3,680.4 million of global annual sales by 2027. The top opportunities in the semiconductor assembly and packaging equipment market segmented by end-user will arise in the OSATs segment, which will gain $6,163.4 million of global annual sales by 2027. The semiconductor assembly and packaging equipment market size will gain the most in China at $1,910.5 million.

Semiconductor Assembly And Packaging Equipment Market Segmentation:
The Semiconductor Assembly And Packaging Equipment market is segmented by type, by application and by end user.

By Type -
a) Plating Equipment
b) Inspection And Dicing Equipment
c) Wire Bonding Equipment
d) Die-Bonding Equipment
e) Other Types

By Application -
a) Consumer Electronics
b) Healthcare Devices
c) Automotive
d) Enterprise Storage
e) Other Applications.

By End-User -
a) OSATs (outsourced semiconductor assembly and test)
b) IDMs (integrated device manufacturers).

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Major players in the Semiconductor Assembly And Packaging Equipment market include Tokyo Electron Ltd, Applied Materials, Inc., Kulicke and Soffa Industries, Inc., ASML Holding N.V, BE Semiconductor Industries N.V.

The regions covered in the global Semiconductor Assembly And Packaging Equipment market are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

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Semiconductor Assembly And Packaging Equipment Market Report Table Of Content
1. Executive Summary
2. Table Of Contents
3. List Of Figures
4. List Of Tables
5. Report Structure
……
18. Competitive Landscape And Company Profiles
19. Key Mergers and Acquisitions
20. Opportunities And Strategies
21. Semiconductor Assembly And Packaging Equipment Market, Conclusions And Recommendations
22. Appendix

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The latest report from The Business Research Company, 'Global Semiconductor Assembly And Packaging Equipment Opportunities And Strategies Market Report - Forecast To 2032,' provides a comprehensive global perspective with data and statistics from 60+ geographies, analyzing 7000+ market segments. The regional and country breakdowns section offers insights into each geography's market analysis, size, historic and forecast growth, and key strategies for industry competitiveness.

This release was published on openPR.