Advanced Packaging Market size is Anticipated to Garner $64.19 Billion by 2027 | Registering a CAGR of 10.2%

Allied Market Research published a report on the Advanced Packaging Market by Type, and End Use: Global Opportunity Analysis and Industry Forecast, 2020-2027. 

The global advanced packaging market size was valued at $29.42 billion in 2019 and projected to reach $64.19 billion by 2027, growing at a CAGR of 10.2% from 2020 to 2027.

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Advanced packaging is a supporting case that prevents physical damage and corrosion to silicon wafers, logic units, and memory, during the final stage of semiconductor manufacturing process. Advanced packaging allows the chip to be connected to a circuit board. In addition, it involves grouping of a variety of distinct techniques, which include 2.5D, 3D-IC, fan-out-wafer-level packaging, and system-in-package.

Advanced packaging market is expected to leverage high potential for the consumer electronics and automotive vertical in 2026. The current business scenario is witnessing an increase in the demand for smart consumer electronics, particularly in the developing regions such as China, India, and others, due to an increase in demand for technological advancements in this sector such as adoption of AI and IoT. Companies in this industry are adopting various innovative techniques such as mergers and acquisition activities, to strengthen their business position in the competitive matrix.

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The advanced packaging market is steadily gaining traction, owing to rise in demand for enhanced technologies in various industry verticals such as integration of IoT, AI, and surge in demand for smart consumer electronics. Technological development by the emerging economies in Asia-Pacific boosts the advanced packaging market growth. The ambitious project of 100 smart cities in India is projected to surge the adoption of smarter solutions for storage, since the project is based on the concept of using sensors and wireless technology to establish a wide connectivity network.

The global advanced packaging market is highly competitive, owing to the strong presence of the existing vendors. Advanced Packaging vendors who have access to extensive technical and financial resources are anticipated to gain a competitive edge over their rivals, as they have the capacity to cater to the global market requirements. The competitive environment in this market is expected to further intensify with increase in technological innovations, product extensions, and different strategies adopted by the key vendors.

Businesses can evaluate the Porter's Five Forces Analysis to determine the structure, level of competition, and industry's strengths and weaknesses. The report also contains information and statistics, tables and figures that are used in strategic planning for the company's success. The report will be remarkable in its ability to provide worldwide investors with the information they need to make informed judgments about the market. Also, these research report provides accurate economic, global, and country-level predictions and analysis.

Competitive Analysis:
The advanced packaging industry key players adopt various strategies such as product launch, product development, collaboration, partnership, and agreements to influence the market. It includes details about the key players in the market's strengths, product portfolio, market size and share analysis, operational results, and market positioning.

Some of the major key players of the advanced packaging industry include:
⦁ Amkor Technology
⦁ Intel Corporation
⦁ Qualcomm Technologies Inc.
⦁ Taiwan Semiconductor Manufacturing Company
⦁ IBM
⦁ Microchip Technology
⦁ Renesas Electronics Corporation
⦁ Texas Instruments
⦁ Analog Devices

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Top Impacting Factors:
The significant factors impacting the advanced packaging market growth of the global advanced packaging sensor market include increase in demand for miniaturization of devices, and improved system performances and optimization of advanced packaging. However, high cost of advanced packaging is hampering its adoption. This hampers the growth of the market. On the contrary, emerging trends of fan-out wafer level packaging are anticipated to provide lucrative opportunities for the advanced packaging market during the forecast period.

Key Benefits for Stakeholders:
⦁ This study comprises analytical depiction of the global advanced packaging market size along with the current advanced packaging market trends and future estimations to depict the imminent investment pockets.
⦁ The overall advanced packaging market analysis is determined to understand the profitable trends to gain a stronger foothold.
⦁ The report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.
⦁ The current advanced packaging market forecast is quantitatively analyzed from 2019 to 2027 to benchmark the financial competency.
⦁ Porter's five forces analysis illustrates the potency of the buyers and suppliers in the advanced packaging market.

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