Wafer Cleaning Equipment Market to reach USD 16.5 billion by 2028

The wafer cleaning equipment market is projected to reach USD 16.5 billion by 2028 from USD 10.1 billion in 2023, at a CAGR of 10.4% from 2023 to 2028.

200 mm wafer size is expected to grow at the second highest growth rate in wafer market during the forecast period

Wafers with a diameter of 200 mm come in two variations: single side polished (SSP) and double side polished (DSP). These wafers find predominant use in various applications including memory, RF devices, and LEDs. The market for 200 mm wafers is projected to experience substantial growth, largely driven by their advantageous cost-effectiveness. The demand for these 200 mm wafers is expected to surge notably due to their expanding utility in a wide spectrum of applications such as power devices, ICs, LEDs, MEMS, and numerous other semiconductor and electronic devices.

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US is expected to hold the highest market share in North America during the forecast period

In the North America region, it is anticipated that the United States will maintain its dominant position in the wafer cleaning equipment market throughout the forecast period. This can be attributed to the notable presence of major manufacturing powerhouses such as Intel Inc. (US), Global Foundries (US), and Maxim Integrated (US) within the nation. These industry leaders primarily engage in wafer processing to fabricate microprocessors, MEMS, and integrated circuits (ICs).

The prevalence of local industry players in the United States, coupled with the export of semiconductor equipment to countries like Germany and France, serves as a driving force for market growth in the US. Among the noteworthy contenders in this sector within the country are Applied Materials, LAM Research, and Novellus Systems, Inc. These entities consistently prioritize the adoption of cutting-edge technology, aiming to deliver innovative and superior products tailored for application within the semiconductor industry.

The break-up of profile of primary participants in the Wafer cleaning equipment market-

By Company Type: Tier 1 - 30%, Tier 2 - 50%, Tier 3 - 20%
By Designation Type: C Level - 25%, Director Level - 35% , Others - 40%
By Region Type: North America - 35%, Europe - 30%, Asia Pacific - 25%, and RoW - 10%

The major players of Wafer cleaning equipment market are SCREEN Holdings Co., Ltd. (Japan), Tokyo Electron Limited (Japan), Applied Materials (US), LAM Research Corporation (US), Shibaura Mechatronics Corporation (Japan), PVA TePLA AG (Germany), Entregris Inc., (US), SEMES (US), Modutek.com (Japan), Veeco Instruments Inc. (US), Toho Technology (US), ULTRON SYSTEMS, INC. (US), Akrion Technologies (US), Axus Technology (US), SHIBAURA MECHATRONICS CORPORATION (Japan), etc.

Research Coverage

The report segments the wafer cleaning equipment market and forecasts its size based on equipment type, wafer size, application, and region. The report also provides a comprehensive review of drivers, restraints, opportunities, and challenges influencing the market growth. The report also covers qualitative aspects in addition to the quantitative aspects of the market.

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This release was published on openPR.