Advanced Packaging Market by Revenue, Growth, Demand and Global Analysis During the Forecast 2030

The advanced packaging market was worth ~US$ 30 billion in 2020; it is expected to grow at a CAGR of 8% to reach US$ 55 billion by 2028. There has been a paradigm shift in the packaging/assembly business in recent times. Although Outsourced Semiconductor Assembly and Tests (OSATs) and Integrated Device Manufacturers (IDMs) have been the key contributors to the market for a long, players with different business models including foundries, substrate/Printed Circuit Board (PCB) suppliers, and Electronic Manufacturing Service (EMS) companies are entering into the assembly/packaging business.

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Global Advanced Packaging Market: Regional Analysis-
The report has been curated after observing and studying various factors that determine regional growth such as economic, environmental, social, technological, and political status of the particular region. Analysts have studied the data of revenue, production, and manufacturers of each region. This section analyses region-wise revenue and volume for the forecast period of 2023 to 2028. These analyses will help the reader to understand the potential worth of investment in a particular region. The report offers in-depth assessment of the growth and other aspects of the Nanophotonic Market in important regions. Key regions covered in the report are North America, Europe, Asia-Pacific and Latin America.

Global Advanced Packaging Market : Competitive Landscape
The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides an overview and forecast of the global market based on various segments. It also provides market size and forecast estimates from the year 2020 to 2028 with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South & Central America. The market by each region is later sub-segmented by respective countries and segments. The report covers the analysis and forecast of 18 countries globally along with the current trend and opportunities prevailing in the region.

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The List of Companies - Advanced Packaging Market
• Amkor technology, Inc.
• ASE Technology Holding Co.Ltd
• Intel Corporation
• Taiwan Semiconductor Manufacturing Company
• SPIL
• PTI
• JCET
• NEPES
• CHIPBOUND
• Samsung

Yageo Corporation Leading market players and manufacturers are studied to help give a brief idea about them in the report. The challenges faced by them and the reasons they are on that position are explained to help make a well informed decision. Competitive landscape of Market is given presenting detailed insights into the company profiles, developments, merges, acquisitions, economic status and best SWOT analysis.

NOTE: Our team is studying Covid-19 and its impact on various industry verticals and wherever required we will be considering Covid-19 analysis of markets and industries. Cordially get in touch for more details.

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Segments-
TSMC earned ~US$ 3.6 billion as advanced packaging revenue in 2020. The company announced an estimated US$2.8 billion CapEx in 2021 for its advanced packaging business, geared explicitly toward SoIC, SoW, and InFO variants, and CoWoS product lines. Further, Intel's investment in various advanced packaging portfolios-such as Foveros, EMIB, and Co-EMIB-is a key to implementing its IDM 2.0 strategy as unveiled by the company's new leadership. The company plans to capitalize on external and internal manufacturing resources to focus on design wins and increased market share, thereby growing Intel's leadership in the client and data center domains.

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About Us:
The Insight Partners is a one stop industry research provider of actionable intelligence. We help our clients in getting solutions to their research requirements through our syndicated and consulting research services. We specialize in industries such as Semiconductor and Electronics, Aerospace and Defense, Automotive and Transportation, Biotechnology, Healthcare IT, Manufacturing and Construction, Medical Device, Technology, Media and Telecommunications, Chemicals and Materials.

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