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3D IC And 2.5D IC Packaging Market Report 2023 - Market Size, Growth Rate, Major Drivers And Key Trends | Samsung Electronics Co. Ltd., Siemens AG, Intel Corporation, Taiwan Semiconductor Manufacturing Company Limited
3D IC And 2.5D IC Packaging Global Market Report
The Business Research Company's 3D IC And 2.5D IC Packaging Global Market Report 2023 identifies the growing demand for consumer electronics is expected to propel the growth of the 3D IC and 2.5D IC packaging market going forward. Consumer electronics refers to any electronic equipment created to be bought and utilized by consumers or end users for personal, daily, and non-commercial uses. 3D IC (Integrated Circuit) and 2.5D IC packaging are advanced packaging technologies that offer enhanced performance, increased functionality, and the miniaturization of electronic devices. The growing demand for consumer electronics and gaming devices is driven by technological advancements, increasing disposable income, gaming industry expansion, digital transformation, remote work, and entertainment trends, changing lifestyles and preferences, and the influence of social media and content consumption.
The global 3D IC and 2.5D IC packaging market is expected to grow from $43.32 billion in 2022 to $48.60 billion in 2023 at a compound annual growth rate (CAGR) of 12.2%. The Russia-Ukraine war disrupted the chances of global economic recovery from the COVID-19 pandemic. The war between these two countries has led to economic sanctions on multiple countries, a surge in commodity prices, and supply chain disruptions, causing inflation across goods and services and affecting many markets across the globe. The 3D IC and 2.5D IC packaging market is expected to reach $73.58 billion in 2027 at a CAGR of 10.9%.
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Major players in the 3D IC and 2.5D IC packaging market are Samsung Electronics Co. Ltd., Siemens AG, Intel Corporation, Taiwan Semiconductor Manufacturing Company Limited, SK Hynix Inc., Broadcom Inc., Fujitsu Limited, Toshiba Corporation, ASE Technology Holding Co. Ltd., Texas Instruments Incorporated, STMicroelectronics NV, Infineon Technologies AG, Renesas Electronics Corporation, United Microelectronics Corporation, GlobalFoundries Inc., Amkor Technology Inc., Unimicron Technology Corporation, Jiangsu Changjiang Electronics Technology Co. Ltd., Cadence Design Systems Inc., Siliconware Precision Industries Co. Ltd., Powertech Technology Inc., Ansys Inc., STATS ChipPAC Pte. Ltd., Synopsys Inc, UTAC Holdings Ltd., Tessolve Semiconductor Private Limited, Invensas Corporation, National Center for Advanced Packaging Co. Ltd., Tohoku-MicroTec Co. Ltd, and TechSearch International Inc.
A key trend in the 3D IC And 2.5D IC Packaging market includes the Technological advancements are a key trend gaining popularity in the 3D IC and 2.5D IC packaging market. Major companies operating in the 3D IC and 2.5D IC packaging market are adopting new technologies to sustain their position in the market.
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The 3D IC And 2.5D IC Packaging market is segmented -
1) By Technology: 3D Wafer-Level Chip-Scale Packaging, 3D TSV (Through-Silicon Via), 2.5D
2) By Application: Logic, Memory, Imaging And Optoelectronics, MEMS Or Sensors, LED, Other Applications
3) By End-user: Telecommunication, Consumer Electronics, Automotive, Military And Aerospace, Medical Devices, Smart Technologies, Other End Users
By Geography: Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. Asia-Pacific was the largest region in the 3D IC And 2.5D IC Packaging market.
The Business Research Company's "Global 3D IC And 2.5D IC Packaging Market Report 2023" provides a thorough understanding of the market across 60 geographies. The report covers market size, growth rate, segments, drivers and trends in every region and country. In addition, the report offers insights on historical and forecast growth, helping players analyze and strategize better.
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The Table Of Content For The 3D IC And 2.5D IC Packaging Market Include:
1. Executive Summary
2. 3D IC And 2.5D IC Packaging Market Characteristics
3. 3D IC And 2.5D IC Packaging Market Trends And Strategies
4. 3D IC And 2.5D IC Packaging Market - Macro Economic Scenario
5. 3D IC And 2.5D IC Packaging Market Size And Growth
……
27. 3D IC And 2.5D IC Packaging Market Competitive Landscape And Company Profiles
28. Key Mergers And Acquisitions In The 3D IC And 2.5D IC Packaging Market
29. 3D IC And 2.5D IC Packaging Market Future Outlook and Potential Analysis
30. Appendix
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