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Global Semiconductor Bonding Market Share To worth USD 1,059 million by 2026 | CAGR of 3.6%

09-21-2023 01:55 PM CET | Advertising, Media Consulting, Marketing Research

Press release from: MarketsandMarkets

Global Semiconductor Bonding Market Share To worth USD 1,059

The global semiconductor bonding market share is projected to grow from USD 887 million in 2021 to USD 1,059 million by 2026; it is expected to grow at a CAGR of 3.6% from 2021 to 2026.

The semiconductor bonding companies report is dominated by a few globally established players such as Intel Corporation (US), Google. Inc (US), NVIDIA Corporation (US), Xilinx Inc. (US), IBM Corporation (US), Advanced Micro Devices, Inc (US), Marvell Technology (Hamilton), and Qualcomm Technology (US).

Browse 100 market data Tables and 49 Figures spread through 205 Pages and in-depth TOC on "Semiconductor Bonding Market Share"

Semiconductor bonding Market Share Dynamics
Driver: Increasing adoption of stacked die technology in IoT devices

The increasing adoption of stacked die technology in IoT devices is driving the growth of the semiconductor bonding market share. Stacked die refers to attaching one bare die on top of each other within a single semiconductor package; it is used to utilize the same placement area on a substrate for multiple functionalities. Die stacking leads to better electrical performance of devices, as the shorter routing of interconnections between circuits results in faster signal generation. Original equipment manufacturers (OEMs) in the semiconductor industry are focusing on leveraging the benefits of IoT beyond connectivity. IoT devices and technologies such as sensors, RFID tags, smart meters, smart beacons, and distribution control systems are increasingly being deployed in applications such as building and home automation, smart manufacturing, connected logistics, smart retail, smart mobility and transportation, etc. Semiconductor bonding techniques are used in IoT devices to attach multi-stacked dies on substrates using minimum space.

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Restraint: High cost of ownership

Semiconductor bonding equipment are sophisticated machines that require high input power to perform die attach operations. The power consumed by these equipment varies from hundreds to thousands of watts. The manufacturing cost of semiconductor bonding equipment is also very high due to the implementation of complex expensive components. The assembly of different big and small parts, such as screen, bonding hand, vacuum, sensors, and the heat source, is also costly. Thus, the overall production and ownership costs of semiconductor bonding equipment for die bonder equipment are relatively high. Additionally, the exorbitant cost of semiconductor wafers increases the operating cost of the semiconductor bonding, thereby hindering the market's growth.

Opportunity: Expanding IC industry in China

The growing demand for thin wafers in the semiconductor industry is a major reason for the growth of the wafer bonding market. The advancements in thin wafers have helped overcome many traditional fabrication processes. With benefits such as ultra-low power consumption and ultra-high electrical performance, the thin wafer industry is attracting Chinese IC manufacturers looking to leverage this technology. At present, the need for thin chips for high performance at a low operating voltage and low cost is the main motive of many IC suppliers in China. Therefore, thin wafer technologies, including wafer bonding, are gaining popularity among Chinese IC manufacturers such as Hisilicon Technologies, Co., Ltd. (China), Spreadtrum Communications (China), and RDA Microelectronics (China).

Challenge: Mechanical unbalance of moving parts and thin wafers being volatile and susceptible to damage caused by pressure or stress

Die bonder equipment use mechanical movements to pick and place the die for the bonding process. The equipment have many moving parts that require precise movement to accurately attach the die to the substrate. However, sometimes, the moving parts can vibrate due to several issues, such as instability and abnormal movement of mechanical joints. The vibration in die bonders can result in misplacement or cracking of the die. The vibration of mechanical parts has become a major challenge for semiconductor bonding equipment manufacturers, which needs to be overcome.
Besi has operations across Europe and APAC. The company has a prominent presence in the electronic supply chain and semiconductor equipment manufacturing market, with Sony (Japan), Toshiba (Japan), Bosch (Germany), etc. as its customers. Its strong customer base spans industries such as aerospace, automotive, consumer electronics, and industrial electronics. Moreover, Besi has online customer service portals, sales offices, agents, and distributors. The company's strong manufacturing and distribution capabilities add to its strength and help it generate increased revenue.

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APAC is likely to continue to dominate the semiconductor bonding market share, in terms of size and CAGR, in the coming years. The commanding position of APAC is due to the presence of a large number of foundries, IDM, and OSAT companies in the region. The major IDMs and foundry players present across the world have their headquarters in APAC. These companies use die bonding equipment in the semiconductor fabrication process. Additionally, an increasing number of IDMs in the region is expected to boost market growth in the near future. Similarly, the mass production of electronic products such as smartphones, wearables, and white goods in China and Taiwan is also expected to accelerate the market's growth in APAC.

Mr. Aashish Mehra
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