Global Silicon on Insulator Market Share To worth USD 2.9 billion by 2027 | CAGR of 15.0%

The global SOI market size is estimated to be USD 1.4 billion in 2022 and is projected to reach 2.9 billion by 2027, at a CAGR of 15.0% during the forecast period. The growing adoption of SOI wafer-based devices in automotive applications and rising demand for 5G in mobile communications play a key role in driving the growth of SOI market in near future.

Soitec (France), Shin-Etsu Chemical (Japan), GlobalWafers (Taiwan), SUMCO Corporation (Japan), Shanghai Simgui Technology (China), GlobalFoundries (US), STMicroelectronics (Switzerland), Tower Semiconductor (Israel), NXP Semiconductors (Netherlands), Murata Manufacturing (Japan), are some of the key players in the SOI market.

Browse 187 market data Tables and 74 Figures spread through 226 Pages and in-depth TOC on "Silicon on Insulator (SOI) Market"

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Market Dynamics

Driver: Rising demand for 5G in mobile communications

5G services began in 2019, with 6G projected in 2030. 5G is a significant step from 4G, boasting ten times the reaction and data transmission speeds. Furthermore, its speed, low latency, and reliability will open numerous applications. Power amplifiers, switches, adjustable capacitors, and filters are commonly found in radiofrequency (RF) front-end modules (FEM) found in smartphones and tablets. Mobile devices use RF silicon-on-insulator (RF-SOI) to adjust and hold cellular signals, giving them clear connections from a wider range of locations. SOI wafers continue to be popular in the mobile market because they provide low insertion loss, minimal harmonics, and strong linearity over a wide frequency range at a reasonable cost.

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Restraint: Certain disadvantages of Silicon on Insulator wafers hampers the growth

There are several disadvantages associated with Silicon on Insulator wafers-reduced breakdown voltage, floating body, and self-heating effects in SOI wafer-based devices. Reduced breakdown voltage levels severely limit the maximum supply voltage at which SOI wafer-based circuits and devices can operate. When the parasitic device turns on, the SOI wafer-based transistor cannot be switched off by changing the gate bias.

Opportunity: Surging adoption of FD-SOI in IoT devices and ML applications

The increasing use of FD-SOI in digital electronics creates opportunities for new IoT devices and applications as this technology ensures ultra-low power consumption, ultra-low current leakage, small and dense packaging, and the cost-efficiency of IoT devices. FD-SOI wafer-based devices have reverse bias characteristics, which help them operate at low voltages without area or cost penalties. Hence, FD-SOI is the most effective technique used in IoT devices. The increasing deployment of FD-SOI-based IoT solutions in automotive and network infrastructure applications is expected to provide opportunities for the growth of the SOI market. FD-SOI is also gaining ground in machine learning.

Challenge: Process control in Silicon on Insulator wafers and circuit design complexity

The complex semiconductor manufacturing process poses hurdles in establishing the processes required for next-generation SOI technology, reducing the process's systematic errors. Another issue with SOI has been circuit design, which necessitates new techniques from a technical standpoint. The SOI circuit designer must better understand the underlying device physics and processes; not doing so will present challenges during fabrication due to manufacturing and metrology problems.

Soitec is a leading company in the design and production of semiconductor materials for chips used in smartphones, tablets, computers, IT servers, data centers, and electronic components in cars, connected devices, and industrial & medical equipment. The product portfolio of Soitec includes silicon-on-insulator (SOI) wafers, piezoelectric-on-insulator (POI) substrates, and gallium nitride (GaN). SOI wafers are the flagship products of Soitec, and the company is the largest producer of these wafers worldwide. Products manufactured by Soitec are equipped with three technologies: smart cut, smart stacking, and epitaxy. The company commercialized the Smart Cut technique, which is now used to manufacture almost all SOI wafers worldwide. Further, the company serves three markets: mobile communications, automotive & industry, and smart devices.

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Europe held the largest share of the SOI market in 2021. The continuously growing semiconductor industry in Europe is one of the prime factors for the growth of SOI. As stated by the World Economic Forum (September 2022), Europe's digital revolution is linked to the revival of the semiconductor sector, post its downfall during the pandemic. The European Union aims to expand its share of the global semiconductor sector from 9% to 30% by 2030. Evolving policy in the European Union and the US is encouraging. Furthermore, Europe's strong academic infrastructure implies that it is ideally positioned to power its digital breakthroughs with home-grown microchips.

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