Press release
Molded Interconnect Device (MID) Global Market is Expected to Grow to $3.16 Billion at a CAGR of 15.4% By 2027 | Molex LLC, TE Connectivity, Amphenol Corporation, MID Solutions, MacDermid Inc.
Molded Interconnect Device Market
The Business Research Company's Molded Interconnect Device (MID) Global Market Report 2023 identifies the increasing demand for consumer electronics is expected to propel the growth of the molded interconnect devices market going forward. Consumer electronics refer to any appliance used in the home or business that includes circuitry.
The global molded interconnect device market is expected to grow from $1.53 billion in 2022 to $1.78 billion in 2023 at a compound annual growth rate (CAGR) of 16.1%. The Russia-Ukraine war disrupted the chances of global economic recovery from the COVID-19 pandemic, at least in the short term. The war between these two countries has led to economic sanctions on multiple countries, a surge in commodity prices, and supply chain disruptions, causing inflation across goods and services and affecting many markets across the globe. The molded interconnect device market is expected to grow to $3.16 billion in 2027 at a CAGR of 15.4%.
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Major players in the molded interconnect device (mid) market are Molex LLC, TE Connectivity, Amphenol Corporation, LPKF Laser & Electronics AG, 2E mechatronic GmbH & Co. KG, Harting Technologiegruppe, Arlington Plating Company, MID Solutions, MacDermid Inc., JOHNAN Corporation, TactoTek Oy, Axon' Cable S.A.S, S2P Solutions, Suzhou Cicor Technology Co. Ltd., and Chogori Technology.
Technological development is the key trend gaining popularity in the molded interconnect device market. Major companies operating in molded interconnect devices are focused on developing new technological solutions flexible across other elements, driving the expansion of technologies such as laser plastic welding.
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The Molded Interconnect Device (MID) Market Is Segmented -
• By Product: Antenna and Connectivity Modules, Connectors and Switches, Sensors, Lighting
• By Process: Laser Direct Structuring (LDS), Two-shot molding, Other Processes
• By Application: Automotive, Consumer products, Healthcare, Industrial, Military and aerospace, Telecommunication And Computing
• By Geography: Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa. Asia-Pacific was the largest region in the Molded Interconnect Device (MID) market.
The Business Research Company's "Global Molded Interconnect Device (MID) Market Report 2023" provides a thorough understanding of the market across 60 geographies. The report covers market size, growth rate, segments, drivers and trends in every region and country. In addition, the report offers insights on historical and forecast growth, helping players analyze and strategize better.
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The Table Of Content For The Molded Interconnect Device (MID) Market Include:
1. Executive Summary
2. Molded Interconnect Device (MID) Market Characteristics
3. Molded Interconnect Device (MID) Market Trends And Strategies
4. Molded Interconnect Device (MID) Market - Macro Economic Scenario
5. Molded Interconnect Device (MID) Market Size And Growth
.....
26. Africa Molded Interconnect Device (MID) Market
27. Molded Interconnect Device (MID) Market Competitive Landscape And Company Profiles
28. Key Mergers And Acquisitions In The Molded Interconnect Device (MID) Market
29. Molded Interconnect Device (MID) Market Future Outlook and Potential Analysis
30. Appendix
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Molded plastics can be modified by adding pigments to their polymers. Higher demand for flexible and functional packaging, largely for packaged food, frozen foods and beverages, is projected to positively impact segment growth in the near future.
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