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Global Embedded Die Packaging Technology Market Report, Market Size, Share, Trends, Analysis and Forecast to 2028
Embedded die packaging technique is a native 3D-compatible packaging method that reduces system in package (SiP) size by 70%. Miniaturization, improves electrical and thermal performance, heterogeneous integration, cost reduction potential, and successful OEM logistics are just a few of the many advantages of this technology. It is highly durable and stable, and it can be integrated into a variety of systems with minimal to no downtime. Because of its better I/O density, smaller size, and multi-die capability on a single platform, embedded die is a desired alternative.
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During the forecast period, North America is expected to grow at the highest CAGR. The most significant contributors to semiconductor consumption in the Americas, particularly North America, are growing consumer electronics, including smart phones, smart watches, smart speakers, digital cameras, smart TVs, etc. The IoT Association reports that the United States has the highest ratio of smart home devices per household and the highest proportion of consumers who tend to possess gadgets with two or three different uses (security, energy, and appliances). The American automotive industry constantly looks for ways to lower costs and increase performance. As a result, there has been tremendous progress in many electrical and electronic components used in automobiles.
Some of the key players in Embedded Die Packaging Technology Market include Amkor Technology Inc., ASE Group, AT&S Group, Fujikura Ltd., Fujitsu Limited, Infenion Technologies AG, Intel Corporation, Microsemi Corporation, Schweizer Electronic AG, Shinko Electric Industries Co. Ltd, STMicroelectronics, Taiwan Semiconductor Manufacturing Company Limited, TDK Corporation, Texas Instruments Incorporation and Toshiba Corporation.
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