Press release
Taiwan IC Packaging and Testing Industry, 2Q 2023
Taiwan IC Packaging and Testing Industry, 2Q 2023This research report provides a forecast of the shipment value for the Taiwanese OSAT (Outsourced Semiconductor Assembly and Test) industry in the first half of 2023, along with a review of the recent quarters from 4Q 2020 to 4Q 2023. The report also includes a breakdown of the shipment value by customer origin and service type. The survey conducted for this research involved major OSAT companies in Taiwan, namely ASE, PTI, KYEC, Siguard, and Ardentec. The content of the report is based on primary data collected through onsite research and publicly available information.
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Key Companies:
• Ardentec
• ASE
• Chipbond
• ChipMOS
• FATC
• KYEC
• OSE
• PTI
• Sigurd
• Walton
• Youngtek Electronic
Table of Contents
Taiwan IC Packaging and Testing Industry Shipment Value, 4Q 2020 - 3Q 2023
Taiwan IC Packaging and Testing Industry Shipment Value by Service Type, 4Q 2020 - 3Q 2023
Taiwan IC Packaging Industry Shipment Value, 4Q 2020 - 3Q 2023
Taiwan IC Testing Industry Shipment Value, 4Q 2020 - 3Q 2023
Taiwan IC Packaging Industry Shipment Value Rankings, 4Q 2020 - 1Q 2023
Taiwan IC Packaging Industry Shipment Value by Vendors' Tier, 4Q 2020 - 1Q 2023
Taiwan IC Testing Industry’s Shipment Value Rankings, 4Q 2020 - 1Q 2023
Taiwan IC Testing Industry Shipment Value by Vendors' Tier, 4Q 2020 - 1Q 2023
Taiwan IC Packaging Industry Shipment Value by Customers' Origin, 4Q 2020 - 1Q 2023
Taiwan IC Packaging Industry Shipment Value Share by Customers' Origin, 4Q 2020 - 1Q 2023
Taiwan IC Testing Industry Shipment Value by Customers' Origin, 4Q 2020 - 1Q 2023
Taiwan IC Testing Industry Shipment Value Share by Customers' Origin, 4Q 2020 - 1Q 2023
Exchange Rate, 4Q 2020 - 4Q 2022
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