Semiconductor Bonding Market Latest Trend, Business Opportunities, And Industry Forecast 2028

According to Premium Market Insights new research study on "Semiconductor Bonding Market Forecast to 2028 -Global Analysis - by Type and Application," the market is expected to grow from US$ 669.48 million in 2022 to reach US$ 1,076.82 million by 2028; it is anticipated to grow at a CAGR of 8.2% from 2022 to 2028.

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Some Of the Major Players Influencing are Palomar Technologies; Panasonic Corporation; Toray Industries Inc; Kulicke & Soffa Industries, Inc.; HUTEM; DIAS Automation (HK) Ltd; ASMPT Ltd (formerly ASM Pacific Technology Ltd.); EV Group; Yamaha Motor Corporation (Yamaha Robotics Holdings); and WestBond, Inc. are a few of the prominent players operating in the semiconductor bonding market.

The growth of the semiconductor industry can be attributed to the use of memory chips, graphics processing units, and 5G chipsets in various devices such as mobile phones, PCs, tablets, and 5G services. However, due to the COVID-19 pandemic, the demand for semiconductors in the industrial and automotive electronics industries declined in 2020. The Semiconductor Industry Association (SIA) reported that the global sales of semiconductors increased from US$204.4 billion in 2000 to US$440.4 billion in 2020, approximately doubling in the last two decades. Despite this growth, the market growth is hindered by the low prices of various chip types, decreasing demand for smartphones, servers, and PCs, and trade disputes between the US and China. The US has imposed several restrictions on Chinese businesses due to national security concerns, and the sanctions against Huawei have adversely affected the company's semiconductor business. Consequently, China's share of the semiconductor industry dropped from 6.7% in 2020 to 6.5% in 2021, according to SIA.

To gain a competitive edge, various players in the semiconductor bonding market are adopting both organic and inorganic strategies. An example of this is ASM Pacific Technology, which in April 2021, introduced three new manufacturing systems that combined X-Celeprint's Micro Transfer Printing and ASM AMICRA's high precision die bonding technology. This integration enables the high-volume heterogeneous integration of ultra-thin dies.

Impact of COVID-19 Pandemic on North America Semiconductor Bonding Market Growth

Semiconductor companies operating in North America are adapting to the challenges of increased costs, supply shortages, and longer lead times while fulfilling consumer demands. The United States Department of Commerce reports that the US accounts for approximately 50% of the global market share of semiconductor production. However, due to the COVID-19 pandemic, there has been a significant decline in demand for major semiconductor components in North America, with the global semiconductor industry experiencing a 5-15% decline in 2020 compared to 2019. The pandemic has had a negative impact on semiconductor companies in the US, which previously relied heavily on outsourcing raw materials and labor from China. On the other hand, Mexico's telecom and automotive sectors are showing growth, which offers opportunities for semiconductor bonding market players. The shutdown of China's borders led to the closure of factories or reduced production, an increase in shipping costs, and additional capacity constraints. As a result, domestic production increased, enabling the US to control the entire supply chain while increasing overall costs. In August 2020, the US government banned the sale of semiconductor chips to Huawei, a Chinese multinational corporation. These initiatives are expected to boost the US semiconductor industry, which, in turn, is expected to drive the growth of the semiconductor bonding market size.

The market for semiconductor bonding in North America is divided into the US, Canada, and Mexico. The US held the largest market share in 2021, while Canada is expected to grow at the highest compound annual growth rate (CAGR). The semiconductor industry in North America has received strong support from government initiatives, leading to an increase in investments in the sector. 3D semiconductor assembly and packaging solutions have been in high demand in the region. The adoption of advanced technologies such as IoT and artificial intelligence by companies, particularly in the automotive sector, is also increasing. Prominent market players in the semiconductor bonding market in North America include Robert Bosch GmbH, Allegro MicroSystems, Inc., Texas Instruments Incorporated, Qualcomm Technologies, Inc., InvenSense, and Honeywell International Inc. The growing demand for MEMS and sensors in the region presents numerous opportunities for companies that manufacture die bonders, wafer bonders, and flip-chip bonders.

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The demand for semiconductor bonding in the US is being driven by its use in the manufacturing of consumer electronics, medical devices, automotive, and other applications. The high sales of automobiles in the country have further boosted the growth of the semiconductor bonding market. Major automakers have invested billions of dollars in electric and autonomous vehicles, with GM announcing a $35 billion investment by 2025. The US government has also announced its plans to invest $50 billion in the semiconductor industry to reduce its dependency on China. In addition, the Arizona government's visit to Taiwan in August 2022 focused on the semiconductor industry for everyday electronic devices. These government initiatives are expected to increase the demand for semiconductor bonding in the US.

The demand for housing units in Canada is expected to increase due to population growth, leading to a rise in demand for household electronic goods. This, in turn, will fuel the demand for semiconductors in the country. The use of various devices such as smartphones, tablets, TVs, and personal computers is also increasing rapidly in Canada, further driving the demand for semiconductor bonding. Canada has 15 free trade agreements with 51 countries, giving semiconductor chip manufacturers access to a combined GDP of US$ 49.3 trillion and 1.5 billion consumers. The country also has several prominent semiconductor companies, including TSMC, Samsung Electronics, AMD, Qualcomm, and Intel. Therefore, the rising demand for smart electronic devices, along with government initiatives, is boosting the growth of the semiconductor bonding market in Canada.

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The semiconductor bonding market analysis has utilized both primary and secondary sources to derive the overall market size and growth. The process began with comprehensive secondary research using internal and external sources to gather qualitative and quantitative information about the semiconductor bonding market. This research aimed to provide an overview and forecast of the market growth across all segments. Furthermore, to validate the data and gain analytical insights, several primary interviews were conducted with industry experts including VPs, business development managers, market intelligence managers, national sales managers, and external consultants such as valuation experts, research analysts, and key opinion leaders, specializing in the semiconductor bonding market.

Table Of Contents
1. Introduction
1.1 Study Scope
1.2 Research Report Guidance
1.3 Market Segmentation
2. Key Takeaways
3. Research Methodology
3.1 Coverage
3.2 Secondary Research
3.3 Primary Research
4. Semiconductor Bonding Market Landscape
4.1 Market Overview
4.2 PEST Analysis
4.2.1 North America
4.2.2 Europe
4.2.3 APAC
4.2.4 MEA
4.2.5 SAM
4.3 Ecosystem Analysis
4.4 Expert Opinions
5. Semiconductor Bonding Market - Key Market Dynamics
5.1 Market Drivers
5.1.1 Rising Adoption of Stacked Die Technology in IoT Devices
5.1.2 Growing Number of Product Launches, Partnerships, and Collaborations Related to Semiconductor Bonding Solutions
5.2 Market Restraints
5.2.1 Fluctuation in the Price of Semiconductor Components
5.3 Market Opportunities
5.3.1 Rising Demand for Hybrid Bonding
5.4 Future Trends
5.4.1 Adoption of Die Bonding in Telecommunication
5.5 Impact Analysis of Drivers and Restraints
Continued…...!

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