Press release
Global Semiconductor Wafer Bonding Equipment Market Research Report 2023
The global Semiconductor Wafer Bonding Equipment market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.North American market for Semiconductor Wafer Bonding Equipment is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for Semiconductor Wafer Bonding Equipment is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of Semiconductor Wafer Bonding Equipment include ASM Pacific Technology, Besi, DIAS Automation, F&K Delvotec Bondtechnik, FASFORD TECHNOLOGY, Hesse, Hybond, Kulicke& Soffa and Palomar Technologies, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
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Key Segmentations
By Company
ASM Pacific Technology
Besi
DIAS Automation
F&K Delvotec Bondtechnik
FASFORD TECHNOLOGY
Hesse
Hybond
Kulicke& Soffa
Palomar Technologies
Panasonic
SHINKAWA Electric
Toray Engineering
West-Bond
Segment by Type
Wire Bonder
Die Bonder
Segment by Application
IDM
OSAT
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
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