With 10.7% CAGR, 3D IC and 2.5D IC Packaging Market Growth to Surpass USD 82.0 billion

The 3D IC and 2.5D IC packaging market is estimated to be worth USD 49.3 billion in 2023 and is projected to reach USD 82.0 billion by 2028, at a CAGR of 10.7% during the forecast period. The rising trend of increased integration density and miniaturization of electronic devices is a major factor driving the growth of 3D IC and 2.5D IC packaging market globally. Moreover, rising number of smart infrastructure and smart city projects is also an important factor contributing to the market growth.

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The emergence of 3D IC packaging and the advancement of other technological trends have resulted in the increased adoption of 3D IC and 2.5D IC packaging for consumer electronics. Moreover, in recent years, the market players are also focusing on providing solutions for data centers, consumer electronics, and automotive electronics. The emergence of new application areas for 3D IC and 2.5D IC packaging is expected to provide growth opportunities for market players offering 3D IC and 2.5D IC packaging solutions.

The growing market for smartphones and high-end computing is generating the need for advanced memory packages. Offered features of advanced packages such as high-speed signal process, low power consumption, and smaller form factor are the driving factors for the adoption of 3D and 2.5D IC packaging for memory applications. Therefore, the 3D IC and 2.5D IC market for this application is expected to grow at the highest rate. 3D IC and 2.5D IC packaging are used for memory applications in specialized AI and ML hardware, such as graphics processing units (GPUs) and tensor processing units (TPUs).

With the growing market penetration of 5G communication technology, the requirement for high-performance and highly integrated semiconductor chips has led to the use of 3D IC packaging. 3D IC packaging offers several advantages over traditional 2D packaging, such as a smaller form factor, improved thermal performance, and increased interconnect density. The demand for advanced packaging in logic ICs, which are being integrated into various network equipment, base stations, and servers in the telecommunications industry, is increasing.

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Key players in the 3D IC and 2.5D IC packaging market are Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US), Broadcom (US), Texas Instruments Inc. (US), United Microelectronics Corporation (Taiwan), JCET Group Co., Ltd. (China) and Powertech Technology Inc. (Taiwan). These players not only have a comprehensive and diverse product portfolio, but also have a strong geographic presence. These players can focus on developing innovative 3D IC and 2.5D IC packaging solutions owing to the emergence of new application areas for 3D IC and 2.5D IC packaging.

News also Covered: https://www.prnewswire.com/news-releases/3d-ic-and-2-5d-ic-packaging-market-worth-82-0-billion-by-2028---exclusive-report-by-marketsandmarkets-301813045.html

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