Panel-Level Packaging Market Size, Growth, In-depth Analysis, Research Report Forecast up to 2028: Deca Technologies and Innocentrix LLC are Key Players.

The prime factors propelling the panel-level packaging market growth are growth in consumer electronics sales and 5G technology and increasing automotive production.

As per the report, the panel-level packaging market is expected to grow at a steady pace between 2021 and 2028.

Panel-level packaging involves assembling electrical components onto a large substrate or panel, and it is made up of glass, ceramic or organic materials. The products like smartphones, laptops, smart wearables, and other electronic devices use panel-level packaging solutions as they help accommodate a more significant number of components in a smaller space. For example, the standard chips in 5G smartphone antenna modules are packaged using panel-level technology. Demand for panel-level packaging is expected to increase owing to the increasing adoption of 5G technology and growing sales of electronic devices. In 2021, Consumer Technology Association (CTA) predicted that sales of consumer electronics would grow by 4.3%, up to $461 billion. According to CTA, in 2022, 5G smartphone sales revenue was USD 61.37 billion, up 15% from USD 53.38 billion in 2021. In 2021, Groupe Speciale Mobile Association (GSMA) predicted that 5G networks will be able to reach one-third of the world's population by 2025, which will raise the demand for 5G devices. The need for more efficient and reliable semiconductors is critical as automotive technology advances. Panel-level packaging offers several advantages over traditional packaging methods for semiconductors as it can allow higher component density and significantly reduce the final product's size. The increasing use of semiconductors in automotive production will boost the demand for panel-level packaging. According to the International Organization of Motor Vehicle Manufacturers (OICA), in 2021, around 68.21% of passenger cars were sold worldwide, with China and the US being the two largest markets in this industry. In November 2021, plans were made by Amkor Technology, Inc. to create panel-level packaging assembly and test solutions for semiconductor and electronic manufacturing companies worldwide. This shows that the market for panel-level packaging is in demand.

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The panel-level packaging market has been segmented into wafer size, end-users, and geography.

Based on the wafer size, the market has been segmented into up to 400mm and more than 400mm.

Based on the end-users, the market has been segmented into automotive, electronics, communications, and others.

By region, Asia Pacific is expected to retain a considerable market share as it is a significant hub for the production of semiconductors and a leader in the advancement of panel-level packaging technologies. Taiwan is home to many major players in the panel-level packaging market, such as TSMC, ASE technology holding, and Powertech technology. These companies are focusing on developing panel-level packaging technologies to increase the functionality and value of their semiconductor products. The Industrial Development Bureau (IDB) of the Taiwanese government launched the "Semiconductor Moonshot Project" in 2020 with the goal of developing advanced packaging technologies, such as panel-level packaging, and the project is anticipated to receive TWD 50 billion (roughly USD 1.8 billion) in funding over five years.

The disruption in the supply chain during the pandemic, as many countries implemented lockdowns and travel restrictions, manufacturers faced difficulties in sourcing raw materials, components, and equipment, leading to delays in production schedules, increased costs, and reduced productivity. As a result, many people lost jobs or had their income reduced, and they had become more cautious about their spending, leading to a decline in sales of electronic devices. This, in turn, led to a reduction in the demand for panel-level packaging.

The major players operating in the panel-level packaging market are Amkor Technologies, ASE Group, Deca Technologies, Innocentrix LLC, JCET Global, PowerTech Technology Inc, Siliconware Precision Industries, SPTS Technologies, and TSMC.

This panel-level packaging market has been analyzed into the following segments:

• By Wafer Size

o Up to 400mm
o More than 400mm

• By End Users

o Automotive
o Electronics
o Communications
o Others

• By Geography

o North America

• United States
• Canada
• Mexico

o South America

• Brazil
• Argentina
• Others

o Europe

• United Kingdom
• Germany
• France
• Spain
• Others

o Middle East and Africa

• UAE
• Israel
• Saudi Arabia
• Others

o Asia Pacific

• Japan
• China
• India
• South Korea
• Thailand
• Taiwan
• Indonesia
• Others

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This release was published on openPR.