Automatic Mounter Wafer Equipment Market Size, Growth, In-depth Analysis, Research Report Forecast up to 2028: Key Players are Lintec Corporation and Nitto Denko.

The primary factors propelling the growth of the automatic mounter wafer equipment market are the growing rate of IoT adoption and the increasing demand for semiconductors.

As per the study, the automatic mounter wafer equipment will expand at a robust pace during the projected period.

An automatic mounter wafer equipment is a machine commonly used in semiconductor fabrication facilities to automate the loading and unloading of wafers from processing tools. It plays a critical role in streamlining the manufacturing process and reducing the risk of contamination, which is essential for maintaining the quality of product standards. The automatic mounter wafer equipment market is increasing due to the adoption of IoT in the semiconductor manufacturing industry to collect data from various machines and equipment, including automatic mounter wafer equipment, and analyze the collected data to identify patterns, detect anomalies, and optimize the manufacturing process for increased productivity, quality, and efficiency. In addition, the growth in the semiconductor industry is driving the automatic mounter wafer equipment market by increasing the demand for semiconductor devices and the need for high-quality and efficient production processes in various industries, such as automotive, consumer electronics, and industrial automation processes.

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The automatic mounter wafer equipment market has been segmented into wafer size, application, and geography.

The market has been classified by wafer size into 150 mm, 200 mm, 300 mm, and others. The 300 mm sized wafer sector is expected to hold a prominent share of the automatic mounter wafer equipment market over the forecast period due to the advancement of technology and the increasing demand for chips with enhanced performance abilities, which is causing a transition towards larger wafer sizes, such as 300 mm or 12-inch wafers among several manufacturers. The 150 mm wafer sector is expected to witness an increase in its consumption among some specific applications, such as power devices and specialized analog circuits. In addition, the 200 mm wafer sector is projected to retain a prominent market share due to its standardized consumption in the semiconductor industry.

Based on application, the segmentation has been done into dicing, protection, and die attach films. However, the dicing sector is anticipated to expand substantially over the forecast period as dicing is a critical process in the semiconductor manufacturing process, and automatic mounter wafer equipment is essential for improving the efficiency and accuracy of this process. Therefore, it is likely that automatic mounter wafer equipment is extensively consumed for dicing applications in comparison with protection and die attach film applications.

By region, the Asia Pacific region is expected to retain a considerable market share driven by the expansion of manufacturing units and the declining production costs in the electronics sector, which will further boost the demand for automatic mounter wafer equipment to produce the required and increase semiconductors demanded by the electronics sector. For example, according to the State Council of the People's Republic of China, the country's major electronics manufacturers' value-added products increased by 12.7% compared to the preceding year in the two months between January and February 2022, in contrast to the 7.5% progress witnessed by the nation's entire manufacturing sector.

The major players covered in the automatic mounter wafer equipment market study are DISCO Corp, Syagrus Systems, Longhill Industries, Lintec Corporation, Nitto Denko, Hibex Singapore Pte Ltd, Takatori, Semiconductor Equipment Corp, QES Group Berhad, and UVFAB Systems, Inc.

This automatic mounter wafer equipment market has been analyzed into the following segments:

• By Wafer Size

o 150mm
o 200mm
o 300mm
o Others

• By Application

o Dicing
o Protection
o Die Attach Films

• By Geography

o North America

• United States
• Canada
• Mexico

o South America

• Brazil
• Argentina
• Others

o Europe

• United Kingdom
• Germany
• France
• Spain
• Others

o Middle East and Africa

• UAE
• Israel
• Saudi Arabia
• Others

o Asia Pacific

• Japan
• China
• India
• South Korea
• Thailand
• Taiwan
• Indonesia
• Others

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This release was published on openPR.