Increasing Demand For Various Consumer Electronics Drives Advanced Packaging Market Size To Reach US$ 74.7 Billion by 2028

The latest research study "Advanced Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028" offers a comprehensive analysis of the industry, which comprises insights on global advanced packaging market Share. The global advanced packaging market size reached US$ 37.1 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 74.7 Billion by 2028, exhibiting a growth rate (CAGR) of 11.2% during 2023-2028.

Advanced packaging refers to the interconnection and aggregation of components that enclose metallic parts and numerous devices, including wafers, logic units, and memory, to protect them from physical damage and corrosion during the final procedure of semiconductor manufacturing. It includes 2.5D, 3D-IC, system-in, and fan-out-wafer-level-package as a combination of several techniques. Advanced packaging methods are implemented after determining various parameters, such as power consumption, operating conditions, measurable size, costs, etc. It increases the functionality of numerous electronic devices, ensures lower power consumption, provides better chip connectivity, and shields silicon chips from mechanical stresses or vibrations. As a result, advanced packaging is extensively utilized in several electronic gadgets and devices.

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Advanced Packaging Market Trends and Drivers:

The expanding applications of packaging in the electronics sector and the increasing demand for various consumer electronics, including wearables, desktops, smartphones, laptops, miniaturized devices, etc., are among the key factors augmenting the advanced packaging market. Furthermore, the escalating utilization of packaging solutions by manufacturers to accomplish delicate patterning in wafers by reducing integrated circuit (IC) sizes in semiconductors is acting as another significant growth-inducing factor. Moreover, the widespread adoption of nano-sized robotic surgery equipment and sophisticated wearable devices is encouraging leading companies to rely on advanced packaging techniques over conventional procedures to promote system optimization, which is also bolstering the market growth. Apart from this, the elevating inclination towards fan-out wafer-level packaging, owing to its numerous benefits, such as superior thermal performance, increased wafer-level yield, easier packaging system, and the acceptance of three-dimensional (3D) circuits, is expected to positively influence the advanced packaging market in the coming years.

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Advanced Packaging Market 2023-2028 Analysis and Segmentation:

Competitive Landscape:

The competitive landscape of the market has been studied in the report with the detailed profiles of the key players operating in the market.

• Advanced Semiconductor Engineering Inc.
• Amkor Technology Inc.
• Analog Devices Inc.
• Brewer Science, ChipMOS Technologies Inc.
• Microchip Technology Inc.
• Powertech Technology Inc.
• Samsung Electronics Co. Ltd
• SÜSS MicroTec SE
• Taiwan Semiconductor Manufacturing Company Limited
• Texas Instruments Incorporated
• Universal Instruments Corporation (CBA Group Inc.).

The report has segmented the market on the basis of type and end use.

Breakup by Type:

• Flip-Chip Ball Grid Array
• Flip Chip CSP
• Wafer Level CSP
• 5D/3D
• Fan Out WLP
• Others

Breakup by End Use:

• Consumer Electronics
• Automotive
• Industrial
• Healthcare
• Aerospace and Defense
• Others

Breakup by Region:

• North America: (United States, Canada)
• Asia Pacific: (China, Japan, India, South Korea, Australia, Indonesia, Others)
• Europe: (Germany, France, United Kingdom, Italy, Spain, Russia, Others)
• Latin America: (Brazil, Mexico, Others)
• Middle East and Africa

Key highlights of the report:

• Market Performance (2017-2022)
• Market Outlook (2023- 2028)
• Porter's Five Forces Analysis
• Market Drivers and Success Factors
• SWOT Analysis
• Value Chain
• Comprehensive Mapping of the Competitive Landscape

If you need specific information that is not currently within the scope of the report, we can provide it to you as a part of the customization.

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