Semiconductor Wafer Polishing and Grinding Market | Transforming Industry: An Actionable Report on Opportunities and Challenges | Key Players - Applied Materials, Inc., EBARA CORPORATION, Lapmaster Wolters, Entrepix, Inc., Revasum., TOKYO SEIMITSU CO. LTD

Global Semiconductor Wafer Polishing and Grinding Market Analysis and Forecast, 2022-2028

The global Semiconductor Wafer Polishing and Grinding market is expected to grow at a CAGR of 4.7% over the forecast period of 2022-2028.

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Market Scope & Overview

The global Semiconductor Wafer Polishing and Grinding market study by RationalStat comprises comprehensive market analysis and insights across the key market segments and geography. The market report analyzes the global market for the historical period of 2019-2021 and the forecast period of 2022-2028 based on the product installed base, key forecasting factors impacting the market conditions, and major market developments happening in the market throughout the analysis period. RationalStat practices primary and secondary research for conducting an insightful market study. Various market parameters such as macroeconomic conditions, market environment, government policies, and competitive landscape are thoroughly studied and taken into account while analyzing the market.

The global Semiconductor Wafer Polishing and Grinding market report also covers value chain and supply chain analysis that provides in-depth information about the value addition at each stage of the product. Market dynamics incorporated in the market study include drivers, restraints/challenges, trends, and their impact on the market throughout the analysis period.

The global Semiconductor Wafer Polishing and Grinding market includes a market share analysis and market structure overview with detailed company profiling of leading players with their financials, product offerings, major developments, etc. This enables, clients and report buyers to make strong, precise, and timely decisions.

State of Global Economy, COVID-19 Outbreak, and the Russo-Ukraine War Impact

The global economy experienced heavy headwinds, throughout 2019-2021, as some countries witnessed subdue growth, while other countries continued to grapple with economic slowdowns. Also, intensifying tension between the US and Iran along with the tightening sanctions on Venezuela by the US further hampered global economic growth in 2019. Moreover, the heightened trade war between the US and China and the rising trade uncertainty continued to exert adverse effects on the global economy. Amid all these, the COVID-19 outbreak at the end of the year 2019 in Wuhan, China further deteriorated global economic growth.

The COVID-19 pandemic has levied undue pressure across the majority of industries globally and has caused a major economic crisis in the US, India, Italy, UK, Germany, India, Japan, South Korea, the UK, and many others. Many of these countries had announced partial or complete nationwide lockdowns. The governments of several nations have called on people to shelter in place at home, travel restrictions, shut down local businesses, and prohibited social gatherings.

The rapid spread of the virus in the early month of 2020 followed by a second wave of COVID-19 caused a significant change in management strategies of the leading industries which have affected the market or industry at a significant level. Besides, the exit of the UK from the European Union earlier in 2020 and the Russo-Ukraine war in 2022 exacerbated the ever-heightened global uncertainty.

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Key Market Segmentation and Companies
RationalStat has segmented the global Semiconductor Wafer Polishing and Grinding market based on equipment type, wafer size, application, and end use.
1.1.Semiconductor Wafer Polishing and Grinding Market by Equipment Type
1.1.1.Segment Overview
10.1.1.1Chemical and Mechanical Polishing Equipment
10.1.1.2Grinders
10.1.1.3Lappers
10.1.1.4Others
10.2Semiconductor Wafer Polishing and Grinding Market by Wafer size
10.2.1Segment Overview
10.2.1.1< 200mm
10.2.1.2200mm 300mm
10.2.1.3> 450mm
10.3Semiconductor Wafer Polishing and Grinding Market by Application
10.3.1Segment Overview
10.3.1.1Memory
10.3.1.2Microprocessor
10.3.1.3Foundry
10.4Semiconductor Wafer Polishing and Grinding Market by End Use
10.4.1Segment Overview
10.4.1.1Consumer Electronics
10.4.1.2Automotives
10.4.1.3Aerospace
10.4.1.4Healthcare
10.4.1.5Others
10.5Semiconductor Wafer Polishing and Grinding Market by Region
10.5.1North America
10.5.2Latin America
10.5.3Western Europe
10.5.4Eastern Europe
10.5.5Asia Pacific
10.5.6Middle East & Africa

By Region
North America
US
Canada
Latin America
Brazil
Mexico
Rest of Latin America
Western Europe
Germany
UK
France
Spain
Italy
Benelux
Nordic
Rest of Western Europe
Eastern Europe
Russia
Poland
Rest of Eastern Europe
Asia Pacific
China
Japan
India
South Korea
Australia
ASEAN (Indonesia, Vietnam, Malaysia, etc.)
Rest of Asia Pacific
Middle East & Africa
GCC
South Africa
Turkey
Rest of the Middle East & Africa

Leading Companies and Market Players:

Applied Materials, Inc.
EBARA CORPORATION
Lapmaster Wolters
Entrepix, Inc.
Revasum.
TOKYO SEIMITSU CO., LTD
Logomatic GmbH
Komatsu NTC
Okamoto corporation
Amtech Systems, Inc.
BBS KINMEI CO., LTD

Table of Content

Chapter One: Market Introduction

1.1. Scope of Study

1.2. Problem Statement

1.3. Market Segmentation

Chapter Two: Assumptions and Acronyms

Chapter Three: Executive Summary
3.1. Global Market in 2022
3.2. Analyst Insights & Recommendations
3.3. Growth Opportunities and Key Strategies
3.4. Supply-side and Demand-side Trends

Chapter Four: Research Methodology

Chapter Five: Analysis of COVID-19 Impact and Road Ahead

Chapter Six: Market Indicators and Background
6.1. Macro-Economic Factors
6.2. Forecasting Factors
6.3. Supply Chain & Value Chain Analysis
6.4. Industry SWOT Analysis
6.5. PESTLE Analysis
6.6. Porter s Five Forces Analysis

Chapter Seven: Government Laws and Industry Regulations

Chapter Eight: Global and Regional Market Dynamics
8.1. Drivers
8.2. Restraints
8.3. Trends
8.4. Opportunities

Chapter Nine: Parent Market Overview
9.1. Global Semiconductor Market

Chapter Ten: Segmental Analysis
10.1. Semiconductor Wafer Polishing and Grinding Market by Equipment Type
10.1.1. Segment Overview
10.1.1.1Chemical and Mechanical Polishing Equipment
10.1.1.2Grinders
10.1.1.3Lappers
10.1.1.4Others
10.2Semiconductor Wafer Polishing and Grinding Market by Wafer Size
10.2.1Segment Overview
10.2.1.1< 200mm
10.2.1.2200mm 300mm
10.2.1.3> 450mm
10.3Semiconductor Wafer Polishing and Grinding Market by Application
10.3.1Segment Overview
10.3.1.1Memory
10.3.1.2Microprocessor
10.3.1.3Foundry
10.4Semiconductor Wafer Polishing and Grinding Market by End Use
10.4.1Segment Overview
10.4.1.1Consumer Electronics
10.4.1.2Automotive
10.4.1.3Aerospace
10.4.1.4Healthcare
10.4.1.5Others
10.5Semiconductor Wafer Polishing and Grinding Market by Region
10.5.1North America
10.5.2Latin America
10.5.3Western Europe
10.5.4Eastern Europe
10.5.5Asia Pacific
10.5.6Middle East & Africa
11Regional Analysis
11.3North America Semiconductor Wafer Polishing and Grinding Market Analysis and Forecast 2019-2028
11.3.1Regional Market Overview and Key Takeaways
11.3.2North America Semiconductor Wafer Polishing and Grinding Market by Equipment Type
11.3.3North America Semiconductor Wafer Polishing and Grinding Market by Wafer Size
11.3.4North America Semiconductor Wafer Polishing and Grinding Market by Application
11.3.5North America Semiconductor Wafer Polishing and Grinding Market by End Use
11.3.6North America Semiconductor Wafer Polishing and Grinding Market by Country
11.3.6.1US
11.3.6.2Canada
11.4Latin America Semiconductor Wafer Polishing and Grinding Analysis and Forecast 2019-2028
11.4.1Regional Market Overview and Key Takeaways
11.4.2Latin America Semiconductor Wafer Polishing and Grinding Market by Equipment Type
11.4.3Latin America Semiconductor Wafer Polishing and Grinding Market by Wafer Size
11.4.4Latin America Semiconductor Wafer Polishing and Grinding Market by Application
11.4.5Latin America Semiconductor Wafer Polishing and Grinding Market by End Use
11.4.6Latin America Semiconductor Wafer Polishing and Grinding Market by Country
11.4.6.1Brazil
11.4.6.2Mexico
11.4.6.3Rest of Latin America
11.5Western Europe Semiconductor Wafer Polishing and Grinding Market Analysis and Forecast 2019-2028
11.5.1Regional Market Overview and Key Takeaways
11.5.2Western Europe Semiconductor Wafer Polishing and Grinding Market by Equipment Type
11.5.3Western Europe Semiconductor Wafer Polishing and Grinding Market by Wafer Size
11.5.4 Western Europe Semiconductor Wafer Polishing and Grinding Market by Application
11.5.5Western Europe Semiconductor Wafer Polishing and Grinding Market by End Use
11.5.6Western Europe Semiconductor Wafer Polishing and Grinding Market by Country
11.5.6.1Germany
11.5.6.2UK
11.5.6.3France
11.5.6.4Spain
11.5.6.5Italy
11.5.6.6Benelux
11.5.6.7Nordic
11.5.6.8Rest of Western Europe
11.6Eastern Europe Semiconductor Wafer Polishing and Grinding Market Analysis and Forecast 2019-2028
11.6.1Regional Market Overview and Key Takeaways
11.6.2Eastern Europe Semiconductor Wafer Polishing and Grinding Market by Equipment Type
11.6.3Eastern Europe Semiconductor Wafer Polishing and Grinding Market by Wafer Size
11.6.4Eastern Europe Semiconductor Wafer Polishing and Grinding Market by Application
11.6.5Eastern Europe Semiconductor Wafer Polishing and Grinding Market by End Use
11.6.6Eastern Europe Semiconductor Wafer Polishing and Grinding Market by Country
11.6.6.1Russia
11.6.6.2Poland
11.6.6.3Rest of Eastern Europe
11.7Asia Pacific Semiconductor Wafer Polishing and Grinding Market Analysis and Forecast 2019-2028
11.7.1Regional Market Overview and Key Takeaways
11.7.2Asia Pacific Semiconductor Wafer Polishing and Grinding Market by Equipment Type
11.7.3Asia Pacific Semiconductor Wafer Polishing and Grinding Market by Wafer Size
11.7.4Asia Pacific Semiconductor Wafer Polishing and Grinding Market by Application
11.7.5Asia Pacific Semiconductor Wafer Polishing and Grinding Market by End Use
11.7.6Asia Pacific Semiconductor Wafer Polishing and Grinding Market by Country
11.7.6.1China
11.7.6.2Japan
11.7.6.3India
11.7.6.4South Korea
11.7.6.5Australia
11.7.6.6ASEAN
11.7.6.7Rest of Asia-Pacific
11.8Middle East & Africa Semiconductor Wafer Polishing and Grinding Market Analysis and Forecast 2019-2028
11.8.1Regional Market Overview and Key Takeaways
11.8.2Middle East & Africa Semiconductor Wafer Polishing and Grinding Market by Equipment Type
11.8.3Middle East & Africa Semiconductor Wafer Polishing and Grinding Market by Wafer Size
11.8.4Middle East & Africa Semiconductor Wafer Polishing and Grinding Market by Application
11.8.5Middle East & Africa Semiconductor Wafer Polishing and Grinding Market by End Use
11.8.6Middle East & Africa Semiconductor Wafer Polishing and Grinding Market by Country
11.8.6.1GCC
11.8.6.2South Africa
11.8.6.3Turkey
11.8.6.4Rest of the Middle East & Africa
12Competitive Landscape
12.3Competition Dashboard
12.3.1Global and Regional Market Share Analysis
12.3.2Market Structure
12.4Competitive Benchmarking
12.5Key Strategy Analysis
12.6Company Profiles
12.6.1Applied Materials, Inc.
12.6.1.1Company Overview
12.6.1.2Product/Service Offerings
12.6.1.3Financials
12.6.1.4Recent Developments
12.6.2Lapmaster Wolters
12.6.2.1Company Overview
12.6.2.2Product/Service Offerings
12.6.2.3Financials
12.6.2.4Recent Developments
12.6.3Entrepix, Inc.
12.6.3.1Company Overview
12.6.3.2Product/Service Offerings
12.6.3.3Key Financials
12.6.3.4Recent Developments
12.6.4Revasum
12.6.4.1Company Overview
12.6.4.2Product/Service Offerings
12.6.4.3Key Financials
12.6.4.4Recent Developments
12.6.5Logomatic GmbH
12.6.5.1Company Overview
12.6.5.2Product/Service Offerings
12.6.5.3Financials
12.6.5.4Recent Developments
12.6.6EBARA CORPORATION
12.6.6.1Company Overview
12.6.6.2Product/Service Offerings
12.6.6.3Financials
12.6.6.4Recent Developments
12.6.7TOKYO SEIMITSU CO., LTD
12.6.7.1Company Overview
12.6.7.2Product/Service Offerings
12.6.7.3Financials
12.6.7.4Recent Developments
12.6.8Komatsu NTC
12.6.8.1Company Overview
12.6.8.2Product/Service Offerings
12.6.8.3Financials
12.6.8.4Recent Developments
12.6.9Okamoto corporation
12.6.9.1Company Overview
12.6.9.2Product/Service Offerings
12.6.9.3Financials
12.6.9.4Recent Developments
12.6.10Amtech Systems, Inc.
12.6.10.1Company Overview
12.6.10.2Product/Service Offerings
12.6.10.3Financials
12.6.10.4Recent Developments
A comprehensive list Semiconductor Wafer Polishing and Grinding brands/manufacturers by country will be provided along with geographical reach, employee count, revenue, product capacities, and their capabilities.
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