Why APAC Is Third-Largest Radiation Hardened Electronics Market?

The market is being driven by the high demand for radiation-hardened components for airplanes, medical equipment, and nuclear power plants. This is why, the radiation-hardened electronics market is predicted to touch $2,104.2 million by 2030, progressing at a 3.5% CAGR from 2021 to 2030. Due to government efforts and investments made by entrepreneurs working in this domain internationally, the space industry is growing.

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Moreover, APAC has the third-largest radiation-hardened electronics market share, it is predicted to boost at the fastest rate in the coming years. This is because many emerging nations, like South Korea, India, and many others are increasingly focusing on building nuclear power facilities to meet their growing energy needs.

RHBD has the largest radiation-hardened electronics market share since it combines innovative concepts, such as component configuration and layout solutions. This method helps to increase dependability in tough settings and enables the modification of circuit activities to prevent cell failure during missions. Additionally, the majority of applications for radioactive materials are integrating electronic components created using the RHBD process.

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Due to the increasing use of sophisticated technologies and shrinking of components, North America has the biggest radiation-hardened electronics market, contributing to a revenue share of about 35%. These developments are predicted to boost the use of radiation-hardened electronics to produce new and affordable solutions.

Private players like SpaceX and Amazon have been able to launch communication satellites into low-Earth orbit in the U.S. due to the country's growing need for secure communication networks from business and government entities. The market will benefit from emerging trends in space exploration, including space tourism, new applications, and component miniaturization.

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This release was published on openPR.