Embedded Die Packaging Technology Market to Garner US$ 242.80 Million, Globally, by 2028 at 18.6% CAGR: The Insight Partners

According to the new research report titled "Embedded Die Packaging Technology Market Forecast to 2028 - COVID-19 Impact and Global Analysis," published by The Insight Partners, the market is expected to reach US$ 242.80 million by 2028, registering a CAGR of 18.6% from 2021 to 2028.

The semiconductor industry is offering innovative products to support digitalization. The rising demand for IoT-based electronic devices to enhance connectivity is further propelling market growth. The Advent of Internet of Things (IoT) connectivity in the global market has created a lucrative opportunity for the market players to develop a new line of IoT-compatible electronic devices. The rising miniaturization of electronics to optimize space and design is being fulfilled with embedded die packaging technology.

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New electronic devices need to offer enhanced performance within a similar space for which major companies are selecting embedded die packaging technology. Advanced packaging technologies have the capacity to resolve micro-chip performance requirements. Embedded die packaging technology offers solutions for various issues such as heat dissipation, power consumption, and product dimension with embedded die for enhanced performance. The embedded die packaging technology is gaining major adoption from North America, Europe, and Asia, while the Middle East & Africa, and South America are likely to be the potential markets during the forecast period.

Further, the advent of smart electronic devices with the integration of multiple processors, sensors, and other components is accelerating market growth. Technology is playing a vital role in developing electronics with a smaller size and low power requirement. Several market players, including Intel, AT&S, and Schweizer, are developing new solutions based on embedded die packaging technology for the consumer market. For instance, Samsung Electro-Mechanics Co. (SEMCO) has developed a six-layer PCB substrate technology to be used in Qualcomm QET5100M envelope tracker for mobile handset applications.

Key Findings of Study:

The global embedded die packaging technology market is fragmented into four major regions-North America, Asia Pacific (APAC), Europe, and the Rest of the World. The market in APAC is projected to experience significant growth during the forecast period. The North American region is projected to grow at the highest CAGR over the forecast period, owing to the strong presence of the semiconductor manufacturing industry and supporting government policies for microelectronics. The region has several electronics manufacturing industries. However, the North American market suffered a huge loss in the first half of 2020, owing to the rising number of COVID-19 cases, specifically in the US. Post-lockdown, the market witnessed an increase in demand for digital devices. North America is among the eminent regions in adopting smart or IoT-based devices due to favorable infrastructure support for high-speed internet services. The adoption of the 5G network is supposed to drive the market post-lockdown. The COVID-19 outbreak had a major impact on manufacturing facilities as production capacities were lowered. As the demand for electronics remained constant, it helped the market to resume growth. For instance, in December 2020, Qualcomm Inc, a leading manufacturer of microprocessors predicted that the shipments of 5G smartphones would double by 2022, with the increasing 5G network deployment. Such increasing adoption of 5G smartphones is lowering the COVID-19 impact on the market during the post-lockdown period.

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Nevertheless, significant strategic initiatives by several industry players are observed in the market; for instance, in February 2018, Microsemi company introduced a new ZL70123 radio frequency (RF) base station module developed using the company's ZL70323 implant module for next-generation medical networks (Med-Net).

The overall embedded die packaging technology market size has been derived using both primary and secondary sources. To begin the research process, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the embedded die packaging technology market. The process also serves the purpose of obtaining an overview and forecast for the Embedded Die Packaging Technology market with respect to all the segments. It also provides the overview and forecast for the global embedded die packaging technology market based on all the segmentation provided with respect to four major regions-North America, Europe, Asia Pacific, and the Rest of the World. Also, primary interviews were conducted with industry participants and commentators to validate data as well as to gain more analytical insights into the topic.

The List of Companies - Embedded Die Packaging Technology Market

ASE Group; Microsemi; General Electric Company; Taiwan Semiconductor Manufacturing Company, Limited; Fujikura Ltd.; Shinko Electric Industries Co., Ltd.; Schweizer Electronic AG; Amkor Technology, Inc.; Infineon Technologies Ag, and AT & S Austria Technologie & Systemtechnik Aktiengesellschaft are among the key players that are profiled during this market study. In addition to these players, several other essential market players from the entire value chain have also been studied and analyzed to get a holistic view of the global embedded die packaging technology market and its ecosystem.

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Contact Us:

If you have any queries about this report or if you would like further information, please contact us:

Contact Person: Sameer Joshi

E-mail: sales@theinsightpartners.com

Phone: +1-646-491-9876

About Us:

The Insight Partners is a one-stop industry research provider of actionable intelligence. We help our clients in getting solutions to their research requirements through our syndicated and consulting research services. We specialize in industries such as Semiconductors and Electronics, Aerospace and Defense, Automotive and Transportation, Biotechnology, Healthcare IT, Manufacturing and Construction, Medical Devices, Technology, Media and Telecommunications, and Chemicals and Materials.

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