openPR Logo
Press release

Embedded Die Packaging Technology Market to Garner US$ 242.80 Million, Globally, by 2028 at 18.6% CAGR: The Insight Partners

03-06-2023 01:22 PM CET | IT, New Media & Software

Press release from: The Insight Partners

/ PR Agency: The Insight Partners
The Insight Partners

The Insight Partners

According to the new research report titled "Embedded Die Packaging Technology Market Forecast to 2028 - COVID-19 Impact and Global Analysis," published by The Insight Partners, the market is expected to reach US$ 242.80 million by 2028, registering a CAGR of 18.6% from 2021 to 2028.

The semiconductor industry is offering innovative products to support digitalization. The rising demand for IoT-based electronic devices to enhance connectivity is further propelling market growth. The Advent of Internet of Things (IoT) connectivity in the global market has created a lucrative opportunity for the market players to develop a new line of IoT-compatible electronic devices. The rising miniaturization of electronics to optimize space and design is being fulfilled with embedded die packaging technology.

Get a Sample Copy of this Report at - https://bit.ly/3JcaclG

New electronic devices need to offer enhanced performance within a similar space for which major companies are selecting embedded die packaging technology. Advanced packaging technologies have the capacity to resolve micro-chip performance requirements. Embedded die packaging technology offers solutions for various issues such as heat dissipation, power consumption, and product dimension with embedded die for enhanced performance. The embedded die packaging technology is gaining major adoption from North America, Europe, and Asia, while the Middle East & Africa, and South America are likely to be the potential markets during the forecast period.

Further, the advent of smart electronic devices with the integration of multiple processors, sensors, and other components is accelerating market growth. Technology is playing a vital role in developing electronics with a smaller size and low power requirement. Several market players, including Intel, AT&S, and Schweizer, are developing new solutions based on embedded die packaging technology for the consumer market. For instance, Samsung Electro-Mechanics Co. (SEMCO) has developed a six-layer PCB substrate technology to be used in Qualcomm QET5100M envelope tracker for mobile handset applications.

Key Findings of Study:

The global embedded die packaging technology market is fragmented into four major regions-North America, Asia Pacific (APAC), Europe, and the Rest of the World. The market in APAC is projected to experience significant growth during the forecast period. The North American region is projected to grow at the highest CAGR over the forecast period, owing to the strong presence of the semiconductor manufacturing industry and supporting government policies for microelectronics. The region has several electronics manufacturing industries. However, the North American market suffered a huge loss in the first half of 2020, owing to the rising number of COVID-19 cases, specifically in the US. Post-lockdown, the market witnessed an increase in demand for digital devices. North America is among the eminent regions in adopting smart or IoT-based devices due to favorable infrastructure support for high-speed internet services. The adoption of the 5G network is supposed to drive the market post-lockdown. The COVID-19 outbreak had a major impact on manufacturing facilities as production capacities were lowered. As the demand for electronics remained constant, it helped the market to resume growth. For instance, in December 2020, Qualcomm Inc, a leading manufacturer of microprocessors predicted that the shipments of 5G smartphones would double by 2022, with the increasing 5G network deployment. Such increasing adoption of 5G smartphones is lowering the COVID-19 impact on the market during the post-lockdown period.

Inquire before Buying at - https://bit.ly/41JnwFK

Nevertheless, significant strategic initiatives by several industry players are observed in the market; for instance, in February 2018, Microsemi company introduced a new ZL70123 radio frequency (RF) base station module developed using the company's ZL70323 implant module for next-generation medical networks (Med-Net).

The overall embedded die packaging technology market size has been derived using both primary and secondary sources. To begin the research process, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the embedded die packaging technology market. The process also serves the purpose of obtaining an overview and forecast for the Embedded Die Packaging Technology market with respect to all the segments. It also provides the overview and forecast for the global embedded die packaging technology market based on all the segmentation provided with respect to four major regions-North America, Europe, Asia Pacific, and the Rest of the World. Also, primary interviews were conducted with industry participants and commentators to validate data as well as to gain more analytical insights into the topic.

The List of Companies - Embedded Die Packaging Technology Market

ASE Group; Microsemi; General Electric Company; Taiwan Semiconductor Manufacturing Company, Limited; Fujikura Ltd.; Shinko Electric Industries Co., Ltd.; Schweizer Electronic AG; Amkor Technology, Inc.; Infineon Technologies Ag, and AT & S Austria Technologie & Systemtechnik Aktiengesellschaft are among the key players that are profiled during this market study. In addition to these players, several other essential market players from the entire value chain have also been studied and analyzed to get a holistic view of the global embedded die packaging technology market and its ecosystem.

Buy Complete Report at - https://bit.ly/3ZiivSO

Contact Us:

If you have any queries about this report or if you would like further information, please contact us:

Contact Person: Sameer Joshi

E-mail: sales@theinsightpartners.com

Phone: +1-646-491-9876

About Us:

The Insight Partners is a one-stop industry research provider of actionable intelligence. We help our clients in getting solutions to their research requirements through our syndicated and consulting research services. We specialize in industries such as Semiconductors and Electronics, Aerospace and Defense, Automotive and Transportation, Biotechnology, Healthcare IT, Manufacturing and Construction, Medical Devices, Technology, Media and Telecommunications, and Chemicals and Materials.

This release was published on openPR.

Permanent link to this press release:

Copy
Please set a link in the press area of your homepage to this press release on openPR. openPR disclaims liability for any content contained in this release.

You can edit or delete your press release Embedded Die Packaging Technology Market to Garner US$ 242.80 Million, Globally, by 2028 at 18.6% CAGR: The Insight Partners here

News-ID: 2962584 • Views:

More Releases from The Insight Partners

Telecom Cloud Market by Demand Analysis, Manufacturers Share, Regions, Risk Analysis, Driving Forces and Application, Forecast to 2031
Telecom Cloud Market by Demand Analysis, Manufacturers Share, Regions, Risk Anal …
The Insight Partners adds "Telecom Cloud Market Forecast to 2031 COVID-19 Impact and Global Analysis" to its store providing analysis of the current and future market competition in the market. Insightful review of the key industry drivers, opportunities, barriers and challenges. Each trend is independently researched to provide qualitative analysis of its implications. Download Sample PDF @ https://www.theinsightpartners.com/sample/TIPRE00003311?utm_source=OpenPR&utm_medium=10881 Key Players Analysis: AT&T Inc. Amazon Web Services Inc Telefonaktiebolaget LM Ericsson Verizon Communications Inc International Business Machines Corp Cisco
Denim Fabrics Market by Demand Analysis, Manufacturers Share, Regions, Risk Analysis, Driving Forces and Application, Forecast to 2031
Denim Fabrics Market by Demand Analysis, Manufacturers Share, Regions, Risk Anal …
The Insight Partners adds "Denim Fabrics Market Forecast to 2031 COVID-19 Impact and Global Analysis" to its store providing analysis of the current and future market competition in the market. Insightful review of the key industry drivers, opportunities, barriers and challenges. Each trend is independently researched to provide qualitative analysis of its implications. Download Sample PDF @ https://www.theinsightpartners.com/sample/TIPRE00018240?utm_source=OpenPR&utm_medium=10881 Key Players Analysis: SANKO Holding Candiani S.p.A. Hyde Park Denim Cone Denim LLC KG DENIM LIMITED Zeva Denim Prosperity Textile T?SA AtlasDenim Arvind Limited The
Split Air Conditioning Market Set for Strong Growth Driven by Energy Efficiency and Smart Home Integration Trends
Split Air Conditioning Market Set for Strong Growth Driven by Energy Efficiency …
New York, US - October 27, 2025 - According to a new report published by The Insight Partners, the Split Air Conditioning Market is projected to witness steady growth from 2025 to 2031, registering a CAGR of XX%. The market size is expected to expand from US$ XX Million in 2024 to US$ XX Million by 2031, fueled by increasing consumer demand for energy-efficient, eco-friendly, and technologically advanced air conditioning
Intelligent Pipeline Pigging Market Projected for 6.3% CAGR Growth During 2025-2031 Forecast Period
Intelligent Pipeline Pigging Market Projected for 6.3% CAGR Growth During 2025-2 …
New York, US - October 27, 2025 - The Intelligent Pipeline Pigging Market is poised for steady expansion, reaching US$ 1,244.2 million by 2031, up from US$ 782.3 million in 2023, registering a CAGR of 6.3% from 2025 to 2031. This strong trajectory highlights the growing importance of advanced pigging solutions that enhance pipeline integrity, operational efficiency, and environmental safety. As global energy and utility networks continue to expand, the demand

All 5 Releases


More Releases for America

Stabilit America Highlights Applications of Fiberglass Roof Panels with Stabilit …
Roofing materials are very important in the realm of modern construction, as they should be long lasting, economical and attractive. Fiberglass roof panels are a few of the numerous choices among several alternatives that have received a reputation of being versatile, long life, and adaptable in various sectors. They are favored by the architects, contractors, and property developers due to their lightweight construction, resistance to weather factors, and the ease
Deodorants Market Report by Region (North America, EMEA, Latin America, Asia)
2025 - Pristine Market Insights, a leading market research firm, announced the release of its latest and comprehensive market research report on Deodorants market. The report spans over 500 pages and delivers 10-year market forecast in US dollars (or custom currencies upon request). It provides in-depth analysis of market dynamics (drivers, opportunities, restraints), PESTLE insights, latest industry trends, and demand factors. The report includes segmented market value, share (%), compound
Sequestrant Market Report by Region (North America, EMEA, Latin America, Asia)
2025 - Pristine Market Insights, a leading market research firm, announced the release of its latest and comprehensive market research report on Sequestrant market. The report spans over 500 pages and delivers 10-year market forecast in US dollars (or custom currencies upon request). It provides in-depth analysis of market dynamics (drivers, opportunities, restraints), PESTLE insights, latest industry trends, and demand factors. The report includes segmented market value, share (%), compound
Buttermilk Market Study by Region (North America, Latin America, Europe, Asia, M …
2025 - Pristine Market Insights, a leading market research firm, announced the release of its latest and comprehensive market research report on Buttermilk market. The report spans over 500 pages and delivers 10-year market forecast in US dollars (or custom currencies upon request). It provides in-depth analysis of market dynamics (drivers, opportunities, restraints), PESTLE insights, latest industry trends, and demand factors. The report includes segmented market value, share (%),
Textiles Market Analysis Report, Regional Outlook - Europe, North America, South …
Adroit Market Research has announced the addition of the “Global Textiles Market Size Status and Forecast 2025”, The report classifies the global Textiles in a precise manner to offer detailed insights about the aspects responsible for augmenting as well as restraining market growth. This report studies the global Textiles Speaker market, analyzes and researches the Textiles Speaker development status and forecast in Europe, North America, Central America, South America, Asia Pacific
Global Gaucher Disease Market 2018 Covering North America, South America, Europe
Gaucher Disease Market Summary The Global Gaucher Disease Market is defined by the presence of some of the leading competitors operating in the market, including the well-established players and new entrants, and the suppliers, vendors, and distributors. The key players are continuously focusing on expanding their geographic reach and broadening their customer base, in order to expand their product portfolio and come up with new advancements. Gaucher Disease market size to maintain the average annual growth